Abstract: Printed wiring boards using surface mount and other components are manufactured using a double-sided tape assembly. The tape assembly is composed of a soluble base layer coated on each side with an adhesive layer, and these layers are sandwiched between top and bottom protective release paper layers. Holes are formed in the tape assembly corresponding to the location of solder pads on the printed wiring board, and the tape assembly is adhered to the printed wiring board after removal of the bottom adhesive layer. Solder paste is applied to the top release layer, filling the holes in the tape assembly. The top release layer is removed, exposing the top adhesive layer, and the component is pressed onto the adhesive layer with its terminations in registry with the solder-filled holes. The board assembly is then soldered, and the remaining base and adhesive layers of the tape assembly are removed by action of a solvent during cleaning.

Abstract: There is disclosed an inspection system which allows the visual inspection of an item and the automatic recordation of the position of a defect or other inspection characteristic in the plane of inspection. In the visual inspection of an electronic circuit card, the card is inserted into a holder which maintains the card in a reference plane which is fixed relative to a plurality of sonic emitters. A microscope or other viewing device is fixed in a predetermined position on a support structure and includes cross hairs or other indicia to allow the visual identification of a particular point on an item that is to be visually inspected. A plurality of sonic receivers are coupled in predetermined positions on the support structure to receive sonic energy generated by the emitters.