Patents by Inventor Jerald Sauber

Jerald Sauber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making an encapsulated filtered feedthrough for an implantable medical device
    Patent number: 10828497
    Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: November 10, 2020
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Randy White, Steven A. Kubow, Scott A. Spadgenske, David A. Chizek, Jerald Sauber
  • ENCAPSULATED FILTERED FEEDTHROUGH FOR IMPLANTABLE MEDICAL DEVICES
    Publication number: 20180207428
    Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
    Type: Application
    Filed: March 23, 2018
    Publication date: July 26, 2018
    Inventors: Patrick J. Barry, Randy White, Steven A. Kubow, Scott A. Spadgenske, David A. Chizek, Jerald Sauber
  • Encapsulated filtered feedthrough for implantable medical devices
    Patent number: 9937354
    Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: April 10, 2018
    Assignee: Cardiac Pacemakers, Inc.
    Inventors: Patrick J. Barry, Randy White, Steven A. Kubow, Scott A. Spadgenske, David A. Chizek, Jerald Sauber
  • ENCAPSULATED FILTERED FEEDTHROUGH FOR IMPLANTABLE MEDICAL DEVICES
    Publication number: 20160287883
    Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
    Type: Application
    Filed: March 24, 2016
    Publication date: October 6, 2016
    Inventors: Patrick J. Barry, Randy White, Steven A. Kubow, Scott A. Spadgenske, David A. Chizek, Jerald Sauber