Patents by Inventor Jerauld J. Cutini

Jerauld J. Cutini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
    Patent number: 6261155
    Abstract: A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film thickness monitor comprising an interferometer can be disposed alongside the belt or at least partially within a region bound by it. The monitoring channel and the film thickness monitor can be used in the CMP process to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: July 17, 2001
    Assignee: LAM Research Corporation
    Inventors: Rahul Jairath, Jiri Pecen, Saket Chadda, Wilbur C. Krusell, Jerauld J. Cutini, Erik H. Engdahl
  • Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
    Patent number: 6146248
    Abstract: A linear polishing belt for use in chemical-mechanical polishing (CMP) of a substrate comprises an opening and a flexible monitoring window secured to the belt to close the opening and to create a monitoring channel in the belt. A plurality of monitoring channels can also be used. A film thickness monitor comprising an interferometer can be disposed alongside the belt or at least partially within a region bound by it. The monitoring channel and the film thickness monitor can be used in the CMP process to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity.
    Type: Grant
    Filed: May 28, 1997
    Date of Patent: November 14, 2000
    Assignee: Lam Research Corporation
    Inventors: Rahul Jairath, Jiri Pecen, Saket Chadda, Wilbur C. Krusell, Jerauld J. Cutini, Erik H. Engdahl