Patents by Inventor Jerber Mendoza

Jerber Mendoza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BACKPLANE CONNECTORS WITH SHIELDED TERMINALS
    Publication number: 20240413590
    Abstract: Backplane connector systems include electromagnetic shielding terminal enclosures to protect high-speed, differential data signals from deleterious electromagnetic signals. Such terminal enclosures include connected, U-shaped shields that include protrusions that slidably contact one another to form a plurality of electrical ground paths. The plurality of paths direct such deleterious signals away from the high-speed, differential data signals.
    Type: Application
    Filed: January 28, 2022
    Publication date: December 12, 2024
    Inventors: Timothy K. Ibarra, Timothy S. Elo, Michael D. Rost, John C. Laurx, William J. Miller, II, Jose J. Gonzalez, Jr., Joel Kwasny, Scott Edwards, Yilin Sung, Jerber Mendoza, Marc E. Krause
  • Wafer for electrical connector
    Patent number: 9728903
    Abstract: A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 8, 2017
    Assignee: Molex, LLC
    Inventors: Jerry A. Long, Eric A. Deichmann, Daniel Tillotson, Michael P. Flynn, Justin Hoyt, Jerber Mendoza
  • WAFER FOR ELECTRICAL CONNECTOR
    Publication number: 20160322760
    Abstract: A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 3, 2016
    Applicant: Molex, LLC
    Inventors: Jerry A. Long, Eric A. Deichmann, Daniel Tillotson, Michael P. Flynn, Justin Hoyt, Jerber Mendoza