Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.

Abstract: A device, system, and method are described. In one embodiment, the device includes a latch. The latch at different times is located in at least a rest position and a non-rest position. The latch receiving a manipulation force to move the latch from the rest position to the non-rest position. The latch is capable of delaying its return to the rest position after a period of time.

Abstract: In one embodiment a housing for an electronic device comprises a first section, a second section, and a collapsible chimney coupled to the first section and the second section to provide an airflow path from a portion of the first section. Other embodiments may be described.

Abstract: In one embodiment, an apparatus may include a processor circuit and a keyframe indexing module that is operative on the processor circuit to map sensor data from a first sensor to a set of video data, where the sensor data and video data correspond to an event. The keyframe indexing module may be further operative on the processor circuit to identify one or more key portions of the set of sensor data, index the one or more key portions to respective mapped one or more video frames of the video data, and generate a first keyframe index to identify the one or more video frames.

Abstract: In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.

Abstract: In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.

Abstract: In one embodiment, a fan casing may have a direct thermal connection with a heat spreader. The fan casing might be used in an active cooling system of a mobile computing device such as a notebook computer to reduce and/or eliminate the occurrence of thermal hot spots on the skin of the device. In one example, the heat spreader extends from the enclosure and is disposed between a heat source and the skin of the device.

Abstract: An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.

Abstract: In one embodiment, a fan casing may have a direct thermal connection with a heat spreader. The fan casing might be used in an active cooling system of a mobile computing device such as a notebook computer to reduce and/or eliminate the occurrence of thermal hot spots on the skin of the device. In one example, the heat spreader extends from the enclosure and is disposed between a heat source and the skin of the device.

Abstract: An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.