Patents by Inventor Jeremey Reukauf

Jeremey Reukauf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR REMOVING MICROFEATURE WORKPIECE SURFACE DEFECTS
    Publication number: 20070161332
    Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.
    Type: Application
    Filed: March 19, 2007
    Publication date: July 12, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Joseph Bastian, Jeremey Reukauf
  • Systems and methods for removing microfeature workpiece surface defects
    Publication number: 20070015446
    Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 18, 2007
    Applicant: Micron Technology, Inc.
    Inventors: Joseph Bastian, Jeremey Reukauf