Patents by Inventor Jeremey T. Reukauf

Jeremey T. Reukauf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for removing microfeature workpiece surface defects
    Patent number: 7854644
    Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: December 21, 2010
    Assignee: Micron Technology, Inc.
    Inventors: Joseph A. Bastian, Jeremey T. Reukauf
  • Systems and methods for removing microfeature workpiece surface defects
    Patent number: 7264539
    Abstract: Systems and methods for removing microfeature workpiece surface defects are disclosed. A method for processing a microfeature workpiece in accordance with one embodiment includes removing surface defects from a surface of a microfeature workpiece by engaging the surface with a buffing medium having a first hardness, and moving at least one of the workpiece and the buffing medium relative to the other. After removing the surface defects and before adding additional material to the microfeature workpiece the method can further include engaging the microfeature workpiece with a polishing pad having a second hardness greater than the first hardness. Additional material can be removed from the microfeature workpiece by moving at least one of the microfeature workpiece and the polishing pad relative to the other.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: September 4, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Joseph A. Bastian, Jeremey T. Reukauf