Abstract: Systems and methods provide an antenna array with separately fed subarrays. The systems and methods provide optimized or improved physical embodiments of each sub-banded subarray in terms of radiating element type and physical implementation, radio frequency integrated circuit (RFIC) technology choice, RFIC packaging and interconnect implementation, and/or intra-subarray feed typology choice and implementation. The antenna array can include first elements within a first distance range from a point in a surface associated with the antenna array and configured for first signals in a first frequency range, and second elements within a second distance range from the point and configured for second signals in a second frequency range. The antenna system also can include an interconnect system comprising a first multichip module and a second multichip module region.

Abstract: Systems and methods provide an antenna array with separately fed subarrays. The systems and methods provide optimized or improved physical embodiments of each sub-banded subarray in terms of radiating element type and physical implementation, radio frequency integrated circuit (RFIC) technology choice, RFIC packaging and interconnect implementation, and/or intra-subarray feed typology choice and implementation. The antenna array can include first elements within a first distance range from a point in a surface associated with the antenna array and configured for first signals in a first frequency range, and second elements within a second distance range from the point and configured for second signals in a second frequency range. The antenna system also can include an interconnect system comprising a first multichip module and a second multichip module region.

Abstract: Systems and methods provide an antenna array with separately fed subarrays. The systems and methods provide optimized or improved physical embodiments of each sub-banded subarray in terms of radiating element type and physical implementation, radio frequency integrated circuit (RFIC) technology choice, RFIC packaging and interconnect implementation, and/or intra-subarray feed typology choice and implementation. The antenna array can include first elements within a first distance range from a point in a surface associated with the antenna array and configured for first signals in a first frequency range, and second elements within a second distance range from the point and configured for second signals in a second frequency range. The antenna system also can include an interconnect system comprising a first multichip module and a second multichip module region.

Abstract: The antenna includes a substrate and a plurality of unit cells coupled to the substrate. Each unit cell includes a dipole feed extending from the substrate, a first antenna dipole coupled to the dipole feed, and a second antenna dipole coupled to the dipole feed. The first antenna dipole includes a first arm on a first side of the dipole feed and a second arm on a second side of the dipole feed opposite the first side. The second antenna dipole includes a third arm on a third side of the dipole feed and a fourth arm on a fourth side of the dipole feed opposite the third side.

Abstract: An antenna system includes a first printed circuit board having an array of printed circuit board antenna elements, a second circuit board having a signal distribution network for the antenna elements, and at least one first interconnect structure coupled between a bottom surface of the first printed circuit board and a top surface of the second circuit board. The first interconnect structure can include first vias having an aspect ratio of greater than 10 to 1. The vias electrically connect to respective first contacts on the bottom surface of the first circuit board and to respective second contacts on the top surface of the second circuit board.

Abstract: An antenna array system includes a feed antenna and circuit boards. Each circuit board has pickup antenna elements disposed on a curved edge portion of a first edge of the circuit board, radiating elements disposed on a second edge portion of the circuit board, and transmit receive modules disposed between the pickup elements and the radiating elements on the circuit board. The antenna array can be part of an active electronically scanned array (AESA) antenna assembly.

Abstract: An antenna array system includes a feed antenna and circuit boards. Each circuit board has pickup antenna elements disposed on a curved edge portion of a first edge of the circuit board, radiating elements disposed on a second edge portion of the circuit board, and transmit receive modules disposed between the pickup elements and the radiating elements on the circuit board. The antenna array can be part of an active electronically scanned array (AESA) antenna assembly.

Abstract: An antenna assembly includes a plurality of RF card assemblies, a backplane circuit board, a plurality of connectors, and a chassis. Each of the RF card assemblies includes a circuit board having a number of antenna elements. The backplane circuit board includes a top surface with at least one set of power supply rails. The connectors are arranged in rows along a top surface of the backplane circuit board. Each of the connectors has an inlet configured to receive one of the RF card assemblies along a plane perpendicular to the top surface of the backplane circuit board. The bottom surface includes power supply pins configured to engage the power supply rails. The chassis is configured to enclose the backplane circuit board, the RF card assemblies, and the connectors.

Abstract: An antenna array and a method of making can use solder connections. The antenna system includes a back plane circuit board having a top surface, first radio frequency circuit boards arranged in rows on the back plane circuit board and perpendicular to the top surface, and second radio frequency circuit boards arranged in columns on the back plane circuit board and perpendicular to the top surface. Each of the first radio frequency circuit boards include at least one first antenna element, and each of the second radio frequency circuit boards include at least one second antenna. The first radio frequency circuit boards and second radio frequency circuit boards are connected to the back plane circuit board by solder connections.

Abstract: An antenna array system includes a feed antenna and circuit boards. Each circuit board has pickup antenna elements disposed on a curved edge portion of a first edge of the circuit board, radiating elements disposed on a second edge portion of the circuit board, and transmit receive modules disposed between the pickup elements and the radiating elements on the circuit board. The antenna array can be part of an active electronically scanned array (AESA) antenna assembly.

Abstract: An active electronically scanned array (AESA) antenna system can include a plurality of printed circuit boards (PCBs) having a common shape. Each PCB of the plurality of PCBs can include a respective sub-array of antenna elements surrounded by a passive area, and can include electronic circuitry for electrically steering the sub-array of antenna elements. The AESA antenna system can include a mechanical seal for mechanically connecting the PCBs hosting the sub-arrays to form an antenna array of the sub-arrays. The passive areas can form separation areas between adjacent ones of the sub-arrays when the PCBs are mechanically connected to each other. The sub-arrays are arranged such that the separation areas are contiguous along at most one straight direction across the antenna array.

Abstract: An electronically scanned array (ESA) is configured for a high-degree of isolation between adjacent radiating elements and between co-located ports. Radiating elements of the ESA include a centrally located slot-aperture configured as a radiating source, and multiple via-apertures positioned around and between each port of the co-located ports. An amount of metamaterial structures found in a unit cell of an antenna layer ascendingly increases from a bottom antenna layer to a top antenna layer, with groups of metamaterial structures differing in orientation with respect to unit cells of two or more antenna layers and with respect to two groups found within a unit cell of the top antenna layer.

Abstract: An antenna array system can include a plurality of sheet metal structures arranged substantially parallel to one another. Each sheet metal structure can include a row of antenna elements and the plurality of sheet metal structures can form an array of antenna elements. The antenna array system can include a plurality of printed circuit boards (PCBs) each of which is mechanically and electrically coupled to a respective sheet metal structure. Each sheet metal structure extends beyond the PCB to which it is mechanically coupled. The antenna array system can include at least one electromagnetic shielding structure configured to electromagnetically shield one or more circuit components from the array of antenna elements. The antenna array system can also include one or more alignment structures configured to provide mechanical rigidity to the array of antenna elements and to allow for spacing between pairs of adjacent sheet metal structures.

Abstract: A fixed antenna includes multiple printed board panels, each containing an array of radiating elements where a subset of radiating elements receives a delayed signal from a feed layer. The number of panels is minimized by configuring each array to generate a shaped beam. The shaped beam is produced by non-uniformly spaced elements and non-uniform array element phase shifts.

Abstract: An Electronically Scanned Array (ESA) antenna is controlled via an optical domain without electrical conductors on the ESA Printed Wiring Board (PWB). Distribution of the control signal occurs over pulses of light through an optical medium separate from the ESA PWB. External to the ESA PWB are one or more optical wave guides functional as communications channels which connect the ESA optical receivers/transceivers with transmitters/transceivers interfaced to a system controller. The ESA is divided into groups of elements with serial busses and discrete signals driven by local controllers. The local controller for each group of elements may include one or more optical receivers (unidirectional) or transceivers (bidirectional). This concept offers a trade in electrical complexity associated with an ESA PWB for an additional manufactured medium redundantly supplying the control signal to the ESA as well as routing the RF data signal from the ESA to the system controller.

Abstract: A method for fabricating a radiating element containment and ground plane structure. The method includes positioning post components, wherein each of the post components has at least one channel. The method further includes positioning a ground plane component including insertion slots and post attachment points. The method also includes attaching the post components to the ground plane component such that each post component is electrically grounded to the ground plane component.

Abstract: An antenna includes a higher order Floquet mode proximity coupled radiating element. The higher order Floquet mode scattering allows good polarization and the radiating element and feed layer can be combined. A vertical probe connects the metal layers of the radiating element for ease of manufacture. The radiating element utilizes higher order dielectric constant materials and a compact Wilkinson power divider allows for a smaller footprint and superior isolation.

Abstract: An electronically scanned array radiating element includes a ground plane layer having a pair of conductive probes. A metallization layer is coupled with the ground plane layer and includes a first asymmetric cluster including HOF scattering members and impedance-matching dipoles. A first electrically-large impedance-matching dipole is coupled with one of the conductive probes and is associated with the first asymmetric cluster. The first electrically-large impedance-matching dipole and the first asymmetric cluster may cooperate with one another to produce a signal. A second asymmetric cluster includes HOF scattering members and impedance-matching dipoles. A second electrically-large impedance-matching dipole is coupled with the other conductive probe and is associated with the second asymmetric cluster. The electrically-large impedance-matching dipole and the asymmetric cluster may cooperate with one another to produce a second signal having a polarization orthogonal to the polarization of the first signal.

Abstract: A hybrid satellite antenna comprises an ESA with two steerable dimensions connected to a motor. The motor rotates the antenna about an axis to position the antenna such that a satellite signal can be sufficiently resolved using the two steerable dimensions of the ESA.

Abstract: An integrated antenna system is disclosed which may include a first antenna sub-system. The integrated antenna system may further include a second antenna sub-system. The first antenna sub-system may be a Ku-band antenna sub-system. The second antenna sub-system may be one of: an L-band antenna sub-system or a C-band antenna sub-system. The second antenna sub-system may be tightly/seamlessly integrated with the first antenna sub-system, thereby providing a system with integrated antenna bands which provides omni-directional coverage.