Patents by Inventor Jeremiah John Kopiness

Jeremiah John Kopiness has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for coupling a semiconductor device of an automation device to a heat sink
    Patent number: 10418308
    Abstract: A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: September 17, 2019
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Paul Jerome Grosskreuz, Rui Zhou, Kelly James Bronk, Jeremiah John Kopiness
  • SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOMATION DEVICE TO A HEAT SINK
    Publication number: 20170141013
    Abstract: A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.
    Type: Application
    Filed: January 31, 2017
    Publication date: May 18, 2017
    Inventors: Paul Jerome Grosskreuz, Rui Zhou, Kelly James Bronk, Jeremiah John Kopiness
  • Systems and methods for coupling a semiconductor device of an automation device to a heat sink
    Patent number: 9570374
    Abstract: A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: February 14, 2017
    Assignee: Rockwell Automation Technologies, Inc.
    Inventors: Paul Jerome Grosskreuz, Rui Zhou, Kelly James Bronk, Jeremiah John Kopiness
  • Motor drive add-on pre-charge capacitive module and method
    Patent number: 9344027
    Abstract: A method for pre-charging a motor drive system includes: pre-charging a motor drive through a motor DC bus where desired, pre-charging an add-on capacitive module through a resistor after a time delay, pre-charging the add-on capacitive module and bypassing the resistor, and disconnecting the add-on capacitive module from the motor DC bus when a fault condition has been detected.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: May 17, 2016
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Jeremiah John Kopiness
  • SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOMATION DEVICE TO A HEAT SINK
    Publication number: 20150194367
    Abstract: A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.
    Type: Application
    Filed: January 3, 2014
    Publication date: July 9, 2015
    Applicant: ROCKWELL AUTOMATIONJ TECHNOLOGIES, INC.
    Inventors: Paul Jerome Grosskreuz, Rui Zhou, Kelly James Bronk, Jeremiah John Kopiness
  • MOTOR DRIVE ADD-ON PRE-CHARGE CAPACITIVE MODULE AND METHOD
    Publication number: 20130328515
    Abstract: A method for pre-charging a motor drive system includes: pre-charging a motor drive through a motor DC bus where desired, pre-charging an add-on capacitive module through a resistor after a time delay, pre-charging the add-on capacitive module and bypassing the resistor, and disconnecting the add-on capacitive module from the motor DC bus when a fault condition has been detected.
    Type: Application
    Filed: June 6, 2012
    Publication date: December 12, 2013
    Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
    Inventor: Jeremiah John Kopiness