Abstract: A spectral imaging device (1312) for capturing one or more, two-dimensional, spectral images (1313A) of a sample (1310) including (i) an image sensor (1328), (ii) an illumination source (1314), (iii) a beam path adjuster (1362), and (iv) a control system (1330). The illumination source (1314) that generates an illumination beam (1316) that is directed along an incident sample beam path (1360) at the sample (1310). The beam path adjuster (1362) selectively adjusts the incident sample beam path (1360).

Abstract: A spectral imaging device (1312) for capturing one or more, two-dimensional, spectral images (1313A) of a sample (1310) including (i) an image sensor (1328), (ii) an illumination source (1314), (iii) a beam path adjuster (1362), and (iv) a control system (1330). The illumination source (1314) that generates an illumination beam (1316) that is directed along an incident sample beam path (1360) at the sample (1310). The beam path adjuster (1362) selectively adjusts the incident sample beam path (1360).

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A spectral imaging device (12) includes an image sensor (28), a tunable light source (14), an optical assembly (17), and a control system (30). The optical assembly (17) includes a first refractive element (24A) and a second refractive element (24B) that are spaced apart from one another by a first separation distance. The refractive elements (24A) (24B) have an element optical thickness and a Fourier space component of the optical frequency dependent transmittance function. Further, the element optical thickness of each refractive element (24A) (24B) and the first separation distance are set such that the Fourier space components of the optical frequency dependent transmittance function of each refractive element (24A) (24B) fall outside a Fourier space measurement passband.

Abstract: A laser assembly (12) for providing an output beam (18) includes a gain medium (16) and a laser housing (20) that retains the gain medium (16). The gain medium (16) generates the output beam (18) when electrical power is directed to the gain medium (16). The laser housing (20) includes a reference redirector (20A) that is used to a reference datum to check the alignment of the output beam (18) relative to the laser housing (20). The reference redirector (20A) can be a mirror that is integrated into the laser housing.

Abstract: A laser assembly (12) for providing an output beam (18) includes a gain medium (16) and a laser housing (20) that retains the gain medium (16). The gain medium (16) generates the output beam (18) when electrical power is directed to the gain medium (16). The laser housing (20) includes a reference redirector (20A) that is used to a reference datum to check the alignment of the output beam (18) relative to the laser housing (20). The reference redirector (20A) can be a mirror that is integrated into the laser housing.

Abstract: Integrated circuit and integrated circuit device diagnostic methods and apparatus in accordance with the present invention are provided. The IC is operated to produce an output marginally above a pass-fail threshold for a particular performance criteria. The IC is made to fail that criteria by inducing an electrical stress in an IC device that is of marginal design for that particular criteria. The electrical stress acts to minutely degrade the performance of the IC device driving the IC below the pass-fail threshold. When each IC device is stressed in accordance with the embodiments of the present invention, marginal IC devices are identified to enable the design to be modified. The induced electrical stress is non-destructive to the IC device and IC, which permits a repeatable diagnostic process, as well as allows for the diagnostic testing of other IC devices in the same microcircuit.

Abstract: Integrated circuit and integrated circuit device diagnostic methods and apparatus in accordance with the present invention are provided. The IC is operated to produce an output marginally above a pass-fail threshold for a particular performance criteria. The IC is made to fail that criteria by inducing an electrical stress in an IC device that is of marginal design for that particular criteria. The electrical stress acts to minutely degrade the performance of the IC device driving the IC below the pass-fail threshold. When each IC device is stressed in accordance with the embodiments of the present invention, marginal IC devices are identified to enable the design to be modified. The induced electrical stress is non-destructive to the IC device and IC, which permits a repeatable diagnostic process, as well as allows for the diagnostic testing of other IC devices in the same microcircuit.

Abstract: An apparatus for fabricating encapsulated micro-channels in a substrate is described. The apparatus includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access windows are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access windows, the one or more micro-channels are formed within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access windows along the dimensions of the desired micro-channels. Accordingly, the apparatus is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the apparatus enables the rapid prototyping of integrated circuits.

Abstract: A method for fabricating encapsulated micro-channels in a substrate is described. The method includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access holes are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access holes, the one or more micro-channels are formed, via the access holes, within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access holes along the dimensions of the desired micro-channels. Accordingly, the method is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the method enables the rapid prototyping of integrated circuits.

Abstract: Time-correlated photon counting is used to measure integrated circuit (IC) performance related to signal jitter (such as clock jitter) in a manner that is non-invasive to the circuit or node of interest. The signal jitter is measured by counting photon emissions at various nodes of interest across a controlled collapse chip connect (C4) mounted die, without interfering with the normal operation of the circuit of interest. This increases the precision and accuracy of the measurement of signal jitter significantly, since small amounts of phase noise on a particular clock signal edge can be detected. The emitted photons can be detected and subsequently correlated to a precise time base to obtain a statistical spread of switching events in time. The range of the photon distribution can be used to reliably determine safe and reasonable timing guard bands for clock and data paths in an IC.

Abstract: Time-correlated photon counting is used to measure integrated circuit (IC) performance related to signal jitter (such as clock jitter) in a manner that is non-invasive to the circuit or node of interest. The signal jitter is measured by counting photon emissions at various nodes of interest across a controlled collapse chip connect (C4) mounted die, without interfering with the normal operation of the circuit of interest. This increases the precision and accuracy of the measurement of signal jitter significantly, since small amounts of phase noise on a particular clock signal edge can be detected. The emitted photons can be detected and subsequently correlated to a precise time base to obtain a statistical spread of switching events in time. The range of the photon distribution can be used to reliably determine safe and reasonable timing guard bands for clock and data paths in an IC.

Abstract: An apparatus for fabricating encapsulated micro-channels in a substrate is described. The apparatus includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access windows are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access windows, the one or more micro-channels are formed within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access windows along the dimensions of the desired micro-channels. Accordingly, the apparatus is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the apparatus enables the rapid prototyping of integrated circuits.

Abstract: A method and apparatus for fabricating encapsulated micro-channels in a substrate is described. The method includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access windows are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access windows, the one or more micro-channels are formed within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access windows along the dimensions of the desired micro-channels. Accordingly, the method is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the method enables the rapid prototyping of integrated circuits.