Abstract: A contact pad includes a first layer of material with a first yield strength and a second layer of material with a second yield strength is laminated to the first layer. A third yield strength of the laminated composite of the first layer and the second layer exceeds the first yield strength and the second yield strength due to the Hall-Petch phenomenon. An overcoat covers an edge of the first layer and the second layer of the contact pad to prevent wear. A method of creating the contact pad or other microelectronic structure includes depositing a first layer of material with a first yield strength on a substrate. A second layer of material with a second yield strength is deposited on the first layer. An edge of the first layer and the second layer is coated with an overcoat material to prevent wear of the first and second layers.

Abstract: A contact pad includes a first layer of material with a first yield strength and a second layer of material with a second yield strength is laminated to the first layer. A third yield strength of the laminated composite of the first layer and the second layer exceeds the first yield strength and the second yield strength due to the Hall-Petch phenomenon. An overcoat covers an edge of the first layer and the second layer of the contact pad to prevent wear. A method of creating the contact pad or other microelectronic structure includes depositing a first layer of material with a first yield strength on a substrate. A second layer of material with a second yield strength is deposited on the first layer. An edge of the first layer and the second layer is coated with an overcoat material to prevent wear of the first and second layers.

Abstract: A head gimbal assembly (HGA) is provided. The HGA includes a suspension that has a suspension coefficient of thermal expansion (CTE) and a slider that has a slider CTE. A bonding element attaches the slider to the suspension. A compensation layer, having a compensation CTE, is located on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider. A method of forming a HGA is also provided. The method includes providing a suspension having a suspension CTE and forming a slider having a slider CTE. The method further includes attaching the slider to the suspension and depositing a compensation layer, having a compensation CTE, on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider.

Abstract: A head gimbal assembly (HGA) is provided. The HGA includes a suspension that has a suspension coefficient of thermal expansion (CTE) and a slider that has a slider CTE. A bonding element attaches the slider to the suspension. A compensation layer, having a compensation CTE, is located on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider. A method of forming a HGA is also provided. The method includes providing a suspension having a suspension CTE and forming a slider having a slider CTE. The method further includes attaching the slider to the suspension and depositing a compensation layer, having a compensation CTE, on the suspension. The compensation layer serves to compensate for a thermal distortion of the slider.

Abstract: A transducer-level microactuator selectively positions a transducer portion of a slider radially with respect to circumferential data tracks of a rotatable disc. The slider includes a slider body having a leading edge and a trailing edge, a transducer body and a flexure body. The transducer body is spaced from the trailing edge of the sliding body and includes at least one transducer element. The flexure body extends from the trailing edge of the slider body and includes a first anchor point connected to the slider body and a second anchor point connected to the transducer body. The basecoat layer is deposited on the trailing edge of the slider body and substantially surrounds the flexure body wherein a gap separates the flexure body from the basecoat. A first actuation assembly is formed on the basecoat and a second actuation assembly is formed on the transducer body adjacent the slider body.