Abstract: A process for coating a molybdenum base with an oxidation resistant layer. The oxidation resistant layer is applied as an oxide powder which is converted to the base metal or metal alloy by heating in a reducing atmosphere. The coating layer is characterized by good adhesion to the base and is readily wet by a solder or brazing material.

Abstract: The present invention is directed to a lead frame having both electrically conductive and electrically non-conductive tie-bar portions. The electrically conductive tie-bar portion allows the attached leads to be simultaneously electroplated, yet is removable from the lead frame, leaving the electrically non-conductive tie-bar portion which provides support for the leads. The advantages to the electrically non-conductive tie-bar portion include substantially decreasing the leads' bending and/or breaking from the package, during both manufacturing and/or testing of the integrated circuit.

Abstract: A flat package for electric microcircuits has an iron-nickel-cobalt alloy frame which is brazed to a molybdenum bottom at a temperature below about 400.degree. C. The molybdenum bottom has successive layers of copper, nickel and gold plating.

Abstract: A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperatures required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the microcircuit during the process of applying the non-organic coating.

Abstract: A microcircuit package and sealing method in which a non-organic coating is used to hermetically seal the microcircuit. The microcircuit is isolated and insulated in order to protect the microcircuit from the high temperature required to apply and cure a non-organic coating. The materials and methods used to isolate and insulate the microcircuit are chosen so that the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the microcircuit during the process of applying the non-organic coating.

Abstract: An all-metal flat package for microcircuits is described which has a copper bottom and a stainless steel frame. Beryllia substrates carrying power chips can readily be soldered into the package which has good heat transfer characteristics.

Abstract: An all-metal flat package for microcircuits is described which has a molybdenum bottom and a Kovar frame. Large 96% alumina substrates carrying heat dissipating microcircuits can readily be soldered into the package which has good transfer characteristics.

Abstract: A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the top of this side wall frame is a one-piece continuous top frame member having a uniform upper surface. This top frame member covers the irregularities present in side wall frame and provides a surface more suitable for hermetic sealing of a package lid to the package.

Abstract: An ultraviolet-transmitting glass window assembly comprising a metallic mounting ring containing an ultraviolet-transmitting glass is made by placing a preformed ultraviolet-transmitting glass member in the center of the metallic ring which has a higher coefficient of thermal expansion than the glass, heating the resulting assembly to melt the glass whereby it completely fills the ring, and cooling the assembly whereby a compression seal is achieved due to the greater shrinkage of the metallic ring. This window assembly is sealed over the memory chip of a programmable read only memory package to provide for ultraviolet erasure of the program information stored in the memory device.