Abstract: A ruggedized miniaturized infrared camera system for harsh environments has an infrared camera module that is connected to a ruggedized camera mount. The camera mount has a body and a lens clamp that clamps the camera lens to the body. The camera mount and military-spec fasteners cooperate to mechanically secure the camera module from vibrations. An interface bracket is attached to the camera mount and has a central opening. A signal connector is attached to the exterior side of the bracket and configured to carry USB2 signals. Conductive pins of the signal connector extend through the central opening and are electrically coupled to a circuit board that is adjacent to the interior side of the bracket. An electrically non-conductive spacer is within the central opening and interposed between the signal connector and circuit board. Heat-conductive epoxy secures the circuit board from vibrations and creates thermal bonds that passively remove heat.

Abstract: A ruggedized camera system provides high-quality optical data signals while operating in harsh environments and includes a housing having an electronics housing section and a lens housing section. A light-ring circuit is attached to the lens housing section. A diffuser ring is attached to the lens housing section and covers the light-ring circuit. The camera system includes camera electronics that process optical data captured by the camera optical lens. The camera electronics are secured within a camera electronics holder that is located within and attached to the electronic housing section and which minimizes vibrations to the camera electronics. A power circuit is inside and attached to the electronic housing section and provides power to the camera electronics and the light-ring circuit and receives serial command data being transmitted to the camera electronics. The housing tightly integrates the camera optical lens, the camera electronics holder, the light-ring circuit and power circuit.