Patents by Inventor Jeremy E. Morin

Jeremy E. Morin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7156252
    Abstract: A closure system for a container comprises a magnetically permeable element such as a metal ring adapted to be affixed on a container adjacent an opening thereof, and a closure such as a membrane lid having a surface formed by a heat seal material, the closure being heat-sealed to a surface of the magnetically permeable element via the heat seal material. The closure further incorporates a magnetized material structured and arranged to attract the magnetically permeable element so as to affix the closure to the magnetically permeable element following removal of the closure therefrom, whereby the closure system is re-closable by magnetic attraction between the closure and magnetically permeable element.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: January 2, 2007
    Assignee: Sonoco Development, Inc.
    Inventor: Jeremy E. Morin
  • Patent number: 6783623
    Abstract: A method of making a spirally wound dry bonded paperboard structure. The method includes adding a radio frequency active adhesive to the paperboard pulp stock during the paperboard fabrication process to first produce an RF active adhesive impregnated paperboard. The impregnated paperboard is then exposed to an RF energy field prior to or during winding, which activates the adhesive. The invention eliminates the need to apply a water-based adhesive to the paperboard prior to forming the structure, thereby reducing water migration into the paperboard.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: August 31, 2004
    Assignee: Sonoco Development, Inc.
    Inventors: Jeremy E. Morin, Krishnaraju Varadarajan
  • Publication number: 20040103985
    Abstract: A method of making a spirally wound dry bonded paperboard structure. The method includes adding a radio frequency active adhesive such as a silicate to the paperboard pulp stock during the paperboard fabrication process to first produce an RF active adhesive impregnated paperboard. The impregnated paperboard is then exposed to an RF energy field prior to or during winding, which activates the adhesive. The invention eliminates the need to apply a water-based adhesive to the paperboard prior to forming the structure, thereby reducing water migration into the paperboard.
    Type: Application
    Filed: August 21, 2003
    Publication date: June 3, 2004
    Applicant: SONOCO DEVELOPMENT, INC.
    Inventors: Jeremy E. MORIN, Krishnaraju VARADARAJAN
  • Publication number: 20040079501
    Abstract: A method of making a spirally wound dry bonded paperboard structure. The method includes adding a radio frequency active adhesive to the paperboard pulp stock during the paperboard fabrication process to first produce an RF active adhesive impregnated paperboard. The impregnated paperboard is then exposed to an RF energy field prior to or during winding, which activates the adhesive. The invention eliminates the need to apply a water-based adhesive to the paperboard prior to forming the structure, thereby reducing water migration into the paperboard.
    Type: Application
    Filed: October 23, 2002
    Publication date: April 29, 2004
    Inventors: Jeremy E. Morin, Krishnaraju Varadarajan
  • Patent number: 6620363
    Abstract: The invention provides new methods for recycling thermoset materials such as natural rubbers, synthetic rubbers, silicone rubbers, and other elastomers and cross-linked polymers (e.g., isoprene rubbers; butyl rubbers; ethylene-propylene-diene-rubbers, “EPDM”; nitrile, or acrylonitrile butadiene rubbers, “NBR”; styrene-butadiene rubbers, “SBR”; hard rubbers such as EBONITE®; mixtures of vulcanized rubbers from discarded tires). The invention is based on the discovery that by combining powdered or particulate thermoset materials with lubricants such as aromatic or paraffinic rubber processing oils or volatile solvents, the thermoset materials can be recycled under moderate temperature and pressure conditions to rapidly produce materials having physical properties comparable to those of virgin thermoset materials. The resulting materials can, for example, be extruded or compaction molded into new shapes such as panels.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: September 16, 2003
    Assignee: University of Massachusetts
    Inventors: Richard J. Farris, Jeremy E. Morin
  • Publication number: 20020101004
    Abstract: The invention provides new methods for recycling thermoset materials such as natural rubbers, synthetic rubbers, silicone rubbers, and other elastomers and cross-linked polymers (e.g., isoprene rubbers; butyl rubbers; ethylene-propylene-diene rubbers, “EPDM”; nitrile, or acrylonitrile butadiene rubbers, “NBR”; styrene-butadiene rubbers, “SBR”; hard rubbers such as EBONITE®; mixtures of vulcanized rubbers from discarded tires). The invention is based on the discovery that by combining powdered or particulate thermoset materials with lubricants such as aromatic or paraffinic rubber processing oils or volatile solvents, the thermoset materials can be recycled under moderate temperature and pressure conditions to rapidly produce materials having physical properties comparable to those of virgin thermoset materials. The resulting materials can, for example, be extruded or compaction molded into new shapes such as panels.
    Type: Application
    Filed: August 1, 2001
    Publication date: August 1, 2002
    Inventors: Richard J. Farris, Jeremy E. Morin