Patents by Inventor Jeremy F. Weinstein

Jeremy F. Weinstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board solder pad arrangement
    Patent number: 8139369
    Abstract: A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: March 20, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Jeremy F. Weinstein, Robert M. Ward
  • PRINTED WIRING BOARD SOLDER PAD ARRANGEMENT
    Publication number: 20090258511
    Abstract: A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions.
    Type: Application
    Filed: April 14, 2008
    Publication date: October 15, 2009
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: Jeremy F. Weinstein, Robert M. Ward