Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.

Abstract: A time series is created that measures a remaining budget amount for a given time period, where the budget amount indicates a maximum number of occurrences of an event allowed for the given time period. More specifically, the given time period is divided into multiple time intervals. For each time interval, a number of occurrences of the event are calculated and detracted from the remaining budget amount to determine a remaining budget amount at the end of the time interval. These time values and associated remaining budget amounts are used to create the time series. This time series may be monitored in real-time, and actions may be taken to avoid future occurrences of the event in response to determining that the remaining budget amount falls below a threshold.

Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.

Abstract: A system and device for communicating information to a train crew of a train is presented. The system links signals along the track directly to assorted operations centers for the transmission of customizable messages. The signal includes a plurality of light emitting diodes within a single flat screen. Information related to any of the following may be presented: wayside coloring patterns, track ownership, mileage indicators, radio communication information, track information, and a general message center. The screen is adjustable in its viewing patterns and may selectively adjust depending on the type of train approaching, the speed of approach, and current conditions.