Patents by Inventor Jeremy Ian Wilson

Jeremy Ian Wilson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7026545
    Abstract: A device and method are provided for reducing impedance, impedance discontinuities, and signal-loop area in flex cables used for a signal path. In one embodiment of the invention, a flex cable is provided for reducing the impedance and length of a return-signal path. The flex cable includes a signal conductor, and a return-signal conductor not connected to ground. The flex cable may also include a ground conductor. Such a flex cable provides a shorter- and lower-impedance return-signal path between a signal source and receiver than do conventional flex cables. In another embodiment of the invention, a method is provided that includes the steps of delivering a signal from a signal source to a signal receiver with a flexible conductor, and returning the signal from the signal receiver to the signal source with another flexible conductor other than ground.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: April 11, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew Harvey Barr, Jeremy Ian Wilson, Robert William Dobbs
  • Patent number: 6843660
    Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: January 18, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew Harvey Barr, Jeremy Ian Wilson, Irving McKenzie Birmingham
  • Publication number: 20040238194
    Abstract: A device and method are provided for reducing impedance, impedance discontinuities, and signal-loop area in flex cables used for a signal path. In one embodiment of the invention, a flex cable is provided for reducing the impedance and length of a return-signal path. The flex cable includes a signal conductor, and a return-signal conductor not connected to ground. The flex cable may also include a ground conductor. Such a flex cable provides a shorter- and lower-impedance return-signal path between a signal source and receiver than do conventional flex cables. In another embodiment of the invention, a method is provided that includes the steps of delivering a signal from a signal source to a signal receiver with a flexible conductor, and returning the signal from the signal receiver to the signal source with another flexible conductor other than ground.
    Type: Application
    Filed: May 28, 2003
    Publication date: December 2, 2004
    Inventors: Andrew Harvey Barr, Jeremy Ian Wilson, Robert William Dobbs
  • Patent number: 6767220
    Abstract: System for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to a electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: July 27, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeremy Ian Wilson, Andrew Harvey Barr, Stephan Karl Barsun
  • Publication number: 20040106321
    Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.
    Type: Application
    Filed: November 21, 2003
    Publication date: June 3, 2004
    Inventors: Andrew Harvey Barr, Jeremy Ian Wilson, Irving McKenzie Birmingham
  • Publication number: 20040106305
    Abstract: Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.
    Type: Application
    Filed: September 25, 2003
    Publication date: June 3, 2004
    Inventors: Jeremy Ian Wilson, Andrew Harvey Barr, Stephan Karl Barsun
  • Publication number: 20040094324
    Abstract: An embodiment of a cable system includes a cable that has a conductor, a power layer and dielectric material. The conductor is operative to carry a signal, the dielectric material is located at least partially between the conductor and the power layer, and the power layer is operative as ground. The power layer is formed of a conductive material and includes a first region and an adjacent second region. The first region includes a greater amount of the conductive material than the second region so that the power layer is less resistant to bending along the second region than along the first region. Methods and other systems are also provided.
    Type: Application
    Filed: November 18, 2002
    Publication date: May 20, 2004
    Inventors: Andrew Harvey Barr, Jeremy Ian Wilson, Irving McKenzie Birmingham
  • Patent number: 6676417
    Abstract: Systems for electrically interconnecting components are provided. One such system comprises: a flex cable having a first end and a second end; a first connector attached to and electrically communicating with the first end of the flex cable; a second connector attached to and electrically communicating with the second end of the flex cable; and a first retention member extending outwardly from the flex cable.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: January 13, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeremy Ian Wilson, Andrew Harvey Barr, Stephan Karl Barsun
  • Patent number: 6538889
    Abstract: A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: March 25, 2003
    Assignee: Hewlett-Packard Company
    Inventors: Stephan Karl Barsun, Jeremy Ian Wilson, Thomas J. Augustin
  • Publication number: 20030053295
    Abstract: A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.
    Type: Application
    Filed: October 16, 2001
    Publication date: March 20, 2003
    Inventors: Stephan Karl Barsun, Jeremy Ian Wilson, Thomas J. Augustin