Patents by Inventor Jeremy J. Schmitz

Jeremy J. Schmitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive dielectric interface
    Patent number: 9693481
    Abstract: A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: June 27, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: John Timmerman, Jeremy J. Schmitz, Jeremy L Hammond
  • Thermally Conductive Dielectric Interface
    Publication number: 20140374071
    Abstract: A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.
    Type: Application
    Filed: June 20, 2014
    Publication date: December 25, 2014
    Inventors: John Timmerman, Jeremy J. Schmitz, Jeremy L. Hammond
  • Method for packaging thermal interface materials
    Patent number: 8430264
    Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: April 30, 2013
    Assignee: The Bergquist Company
    Inventors: Radesh Jewram, William E. McIntosh, Jeremy J. Schmitz
  • Method for Packaging Thermal Interface Materials
    Publication number: 20110186586
    Abstract: A package for delivery of a tacky product includes a carrier with a plurality of cavities separately disposed along a length and width thereof. Each of the cavities in the carrier tape includes a base that is sized to operably receive and support the product within the cavity. The base of each cavity includes a surface profile which defines a contact surface area that is sufficiently low so as to facilitate removal of the product from the cavity without damage to the product. In some cases, the contact surface area is less than about 50% of a base surface area of the base. The carrier may be configured to stack with other carriers without risk of damage to the tacky product.
    Type: Application
    Filed: April 12, 2011
    Publication date: August 4, 2011
    Inventors: Radesh Jewram, William E. McIntosh, Jeremy J. Schmitz