Patents by Inventor Jeremy Kaspar Stephens

Jeremy Kaspar Stephens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
    Patent number: 6379222
    Abstract: Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: April 30, 2002
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corporation
    Inventors: Michael Lester Wise, Jeremy Kaspar Stephens, Suri G. Hedge
  • Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
    Patent number: 6020262
    Abstract: Areas of different temperatures are provided on a semiconductor wafer to improve uniformity in polishing rates during CMP.
    Type: Grant
    Filed: March 6, 1998
    Date of Patent: February 1, 2000
    Assignees: Siemens Aktiengesellschaft, International Business Machines Corp.
    Inventors: Michael Lester Wise, Jeremy Kaspar Stephens, Suri G. Hedge