Patents by Inventor Jeremy Kenneth Kramer

Jeremy Kenneth Kramer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low drain-source on resistance semiconductor component and method of fabrication
    Patent number: 11387373
    Abstract: A device wafer is provided that includes a substrate having major and minor surfaces, and a plurality of active devices located at the major surface. A eutectic alloy composition having a first thickness is formed at the minor surface of the substrate. The eutectic alloy composition is partially removed from the minor surface of the substrate such that a second thickness of the eutectic alloy composition remains on the minor surface, the second thickness being less than the first thickness. A bonding layer is deposited over the eutectic alloy composition. The bonding layer is utilized for joining semiconductor components of the device wafer to secondary structures.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: July 12, 2022
    Assignee: NXP USA, Inc.
    Inventors: Colby Greg Rampley, Jeffrey Lynn Weibrecht, Jeremy Kenneth Kramer, Elijah Blue Foster, Melissa Picard
  • LOW DRAIN-SOURCE ON RESISTANCE SEMICONDUCTOR COMPONENT AND METHOD OF FABRICATION
    Publication number: 20210036169
    Abstract: A device wafer is provided that includes a substrate having major and minor surfaces, and a plurality of active devices located at the major surface. A eutectic alloy composition having a first thickness is formed at the minor surface of the substrate. The eutectic alloy composition is partially removed from the minor surface of the substrate such that a second thickness of the eutectic alloy composition remains on the minor surface, the second thickness being less than the first thickness. A bonding layer is deposited over the eutectic alloy composition. The bonding layer is utilized for joining semiconductor components of the device wafer to secondary structures.
    Type: Application
    Filed: July 29, 2019
    Publication date: February 4, 2021
    Inventors: Colby Greg Rampley, Jeffrey Lynn Weibrecht, Jeremy Kenneth Kramer, Elijah Blue Foster, Melissa Picard