Abstract: An apparatus includes an elongate thin film body extending from a first end to a second end. A plurality of electrodes is disposed on the thin film body. A plurality of electrode connection traces each coupled to a respective one of the electrodes. A plurality of attachment structures is placed at predetermined locations about the thin film body. An outer molding surrounds the thin film body. The attachment structures provide connection points for the outer molding, thus allowing for adhesion between the outer molding and the thin film body.

Abstract: A lead assembly includes a thin film body supporting a plurality of electrodes configured to provide electrical stimulation or sensing. The thin film body includes a substrate. A plurality of electrode connection traces is situated on the thin film body and electrically connected to respective ones of the plurality of electrodes. A connection wire is configured to provide stimulation or sensing signals for transmission to the plurality of electrodes. The connection wire extends from a lead and is substantially larger than each of the electrode connection traces. A coupling structure is configured to provide electrical connection between the connection wire and the electrode connection traces.

Abstract: An apparatus includes an elongate thin film body extending from a first end to a second end. A plurality of electrodes is disposed on the thin film body. A plurality of electrode connection traces each coupled to a respective one of the electrodes. A plurality of attachment structures is placed at predetermined locations about the thin film body. An outer molding surrounds the thin film body. The attachment structures provide connection points for the outer molding, thus allowing for adhesion between the outer molding and the thin film body.