Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: A decorated particle comprises a single inorganic particle core having an uneven outer surface with a plurality of crevices and an average particle diameter of 20 to 150 microns. A binder retaining decorating particles is disposed on at least a portion of the outer surface of the inorganic particle core and fills the crevices. The decorating particles have an average particle diameter of 0.05 to 10 microns. A method of making decorated particles is also disclosed.

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.

Abstract: The present disclosure relates to an acid-curable composition, comprising: a) abase component comprising a cationically self-curable oligomeric compound; and b) a curing system for the cationically self-curable oligomeric compound, which comprises an ionogenic compound comprising an anion and an aminium ion as a cation. According to another aspect, the present disclosure is directed to a curing system suitable for an acid-curable composition comprising a cationically self-curable oligomeric compound. According to still another aspect, the present disclosure relates to a method of manufacturing an acid-curable composition. In yet another aspect, the disclosure relates to the use of an acid-curable composition for industrial applications, in particular for thermal management applications in the automotive industry.

Abstract: The present disclosure relates to an acid-curable composition, comprising: a) a base component comprising a cationically self-curable oligomeric compound; b) a curing system for the cationically self-curable oligomeric compound, which comprises: i. an ionogenic compound comprising an anion and ammonium as a cation; and ii. water. According to another aspect, the present disclosure is directed to a curing system suitable for an acid-curable composition comprising a cationically self-curable oligomeric compound. According to still another aspect, the present disclosure relates to a method of manufacturing an acid-curable composition. In yet another aspect, the disclosure relates to the use of an acid-curable composition for industrial applications, in particular for thermal management applications in the automotive industry.

Abstract: A thermally conductive dielectric film includes a thermoplastic layer including polyester segments and 5 to 30% by wt polyether amide segments. The thermally conductive dielectric film has a thickness of less than 100 micrometers.

Abstract: Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

Abstract: Control cure thermally-conductive gap filler materials are described, as are methods of curing. Also described are curing agents and methods of making curing agents.

Abstract: A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

Abstract: The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

Abstract: The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

Abstract: A curable composition includes a polyamide composition comprising a polyamide. The polyamide comprises a tertiary amide in the backbone thereof and is amine terminated. The curable composition also comprises an epoxy composition that includes an epoxy resin.

Abstract: An oriented film includes, an orientated polyester layer, and alumina particles dispersed within the orientated polyester layer. The alumina particles are present in an amount from 20 to 40% wt of the orientated film. The alumina particles having a D99 value of 25 micrometers or less.

Abstract: A method of making a resin composition is described comprising providing a mixture of boron nitride particles and cellulose nanocrystals and combining the mixture with a resin composition. The weight ratio of boron nitride to cellulose nanocrystals typically ranges from 99.9:0.1 to 90:10. The resin composition can have a viscosity at least a 5, 10, 15, 20 or 25% lower than the same composition without the cellulose nanocrystals, which facilitate processing efficiency and is also amenable to incorporating higher boron nitride concentrations into the resin composition. Also described is a (e.g. powder) composition comprising premixed boron nitride particles and cellulose nanocrystals and resin composition comprising such (e.g. powder) composition.

Abstract: An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.

Abstract: One-part curable compositions include a thermally curable powder composition with at least one solid epoxy resin, and at least one solid epoxy curative resin. The epoxy resin and the epoxy curative resin are melted, mixed, quenched and powderized. The solid epoxy resin may include a benzofuran diepoxide, a modified benzofuran diepoxide, or a combination thereof.

Abstract: An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.