Patents by Inventor Jeremy Mishler

Jeremy Mishler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for over-molded PCB sealing ring for TEC heat exchangers
    Patent number: 10161642
    Abstract: A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: December 25, 2018
    Assignee: Marlow Industries, Inc.
    Inventors: Michael Giraud, Jeremy Mishler
  • SYSTEM FOR OVER-MOLDED PCB SEALING RING FOR TEC HEAT EXCHANGERS
    Publication number: 20150233592
    Abstract: A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies.
    Type: Application
    Filed: February 17, 2015
    Publication date: August 20, 2015
    Inventors: Michael Giraud, Jeremy Mishler