Patents by Inventor Jeremy R. Tolbert

Jeremy R. Tolbert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit development using density-aware border fill
    Patent number: 11861287
    Abstract: Aspects of the invention include setting a fill mode for a border region of a layer of a macro of an integrated circuit. The border region has a depth defined by a multiple of the size of a tile used to select an area of the integrated circuit for implementation of a design rule check, and the fill mode indicates a fill percentage value or level of fill to be implemented in the border region of the layer of the macro. A fill of the border region of the layer of the macro is performed based on the fill mode. The integrated circuit is finalized and fabricated based on the performing of the fill and passing the design rule check.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: January 2, 2024
    Assignee: International Business Machines Corporation
    Inventors: Hongmei Li, Rasit Onur Topaloglu, Peter A. Smith, Jeremy R. Tolbert
  • INTEGRATED CIRCUIT DEVELOPMENT USING DENSITY-AWARE BORDER FILL
    Publication number: 20230034219
    Abstract: Aspects of the invention include setting a fill mode for a border region of a layer of a macro of an integrated circuit. The border region has a depth defined by a multiple of the size of a tile used to select an area of the integrated circuit for implementation of a design rule check, and the fill mode indicates a fill percentage value or level of fill to be implemented in the border region of the layer of the macro. A fill of the border region of the layer of the macro is performed based on the fill mode. The integrated circuit is finalized and fabricated based on the performing of the fill and passing the design rule check.
    Type: Application
    Filed: August 2, 2021
    Publication date: February 2, 2023
    Inventors: Hongmei Li, Rasit Onur Topaloglu, Peter A. Smith, Jeremy R. Tolbert