Patents by Inventor Jeremy S. Chiu

Jeremy S. Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230253148
    Abstract: A signal coupling device comprises a low-frequency circuit including a magnetic ring having an opening and a high-frequency circuit including a rod-shaped magnet. A first-level circuit is formed around the magnetic ring and extends between a first-level circuit input and a first-level circuit output. A second-level circuit is formed around the magnetic ring and extends between a second-level circuit input and a second-level circuit output. The high-frequency circuit includes a third-level circuit formed around the rod-shaped magnet and extends between a third-level circuit input and a third-level circuit output. A fourth-level circuit is formed around the rod-shaped magnet and extends between a fourth-level circuit input and a fourth-level circuit output. The first-level circuit output is coupled to the third-level circuit input and the second-level circuit output is coupled to the fourth-level circuit input.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 10, 2023
    Applicant: Quantage, Inc.
    Inventors: Jeremy S. Chiu, Kuan-Hsiung Wei, Farid Hamidy
  • Patent number: 7988460
    Abstract: A connection device includes an electrical engagement structure. The connection device includes a connector and a printed circuit board (PCB) based tongue. The PCB based tongue is received and retained in the connector and has a distal end extending toward an open-cavity plug receiving side of the connector in such a way that side edges of the tongue are spaced from corresponding inner walls of the connector. As such, the connector is made compatible to various buses through the PCB based tongue that include contacts that are selectively arranged to correspond to the buses.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: August 2, 2011
    Assignee: DNOVA Corporation
    Inventors: Jeremy S. Chiu, Hsuan-Ho Chung