Patents by Inventor Jeremy Spiteri

Jeremy Spiteri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9698040
    Abstract: A semiconductor device carrier tape with image sensor detectable dimples is disclosed. The dimpled carrier tape is formed of a flexible strip of material. A plurality of pockets are disposed spaced apart along the length of the flexible strip of material. Each pocket is configured to hold a semiconductor device. A dimple is formed in each of the plurality of pockets where each dimple has a peripheral edge and a bottom surface. Detection of the dimple by an image sensor facilitates alignment of a semiconductor device with the pocket and precise placement of the semiconductor device in the pocket.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: July 4, 2017
    Assignee: STMicroelectronics (Malta) Ltd
    Inventors: Jeremy Spiteri, Ivan Ellul
  • Publication number: 20170125276
    Abstract: A semiconductor device carrier tape with image sensor detectable dimples is disclosed. The dimpled carrier tape is formed of a flexible strip of material. A plurality of pockets are disposed spaced apart along the length of the flexible strip of material. Each pocket is configured to hold a semiconductor device. A dimple is formed in each of the plurality of pockets where each dimple has a peripheral edge and a bottom surface. Detection of the dimple by an image sensor facilitates alignment of a semiconductor device with the pocket and precise placement of the semiconductor device in the pocket.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 4, 2017
    Applicant: STMicroelectronics (Malta) Ltd
    Inventors: Jeremy Spiteri, Ivan Ellul
  • Patent number: 8921164
    Abstract: A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: December 30, 2014
    Assignees: STMicroelectronics Ltd (Malta), STMicroelectronics S.r.l.
    Inventors: Kenneth Fonk, Luca Maggi, Jeremy Spiteri