Abstract: An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

Abstract: A microhollow cathode discharge (MHCD) cavity and microfluidic channel are combined for interrogation of samples. The apparatus includes a dielectric body and layers of conductive material defining a MHCD cavity containing an environment for carrying a gas discharge within the MHCD cavity. The gas discharge generates gas based electromagnetic waves. Electrical connections apply a cathode discharge potential to the layers of conductive material. A microfluidic channel is integrated on the substrate, and a path extends from the MHCD cavity laterally through a portion of the microfluidic channel. A detector, which may be integrated on the common substrate, is positioned to receive electromagnetic waves from the path and electronic circuitry is coupled to the detector for acquiring and processing data.

Abstract: Cast-on-resist (COR) methods and apparatus are provided for forming green-sheets. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is also comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (100) having the negative image of the pattern, applying ceramic slurry (212) on the casting substrate (100), curing the ceramic slurry (212) on the casting substrate (100), and removing the ceramic slurry (212) from the casting substrate (100) after the curing.

Abstract: Cast-on-resist (COR) methods of manufacturing patterned ceramic layers that can be used in forming a multilayered ceramic device are provided according to preferred exemplary embodiments of the present invention.

Abstract: A cast-on-resist (COR) method of forming a ceramic layer (114) with a recessed pattern is provided according to a preferred exemplary embodiment of the present invention. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is further comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (110) having the negative image of the pattern, applying ceramic slurry (112) on the casting substrate (110), curing the ceramic slurry (112) on the casting substrate (110) and removing the ceramic layer (114) from the casting substrate (110) after the curing.

Abstract: A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via in a first layer, filling the first via with a cross-linkable paste, curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.