Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.

Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.

Abstract: A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces.

Abstract: A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces.

Abstract: A dispenser (10) for flowable, viscous material (52) includes a housing (12) comprising a main body (18) and door (20), and a reservoir (50) for the material (52) with an elongated, synthetic resin deformable outlet tube (80) presenting an outlet end (82) coupled to the reservoir (50). A flow-controlling assembly (16) including a tube-engaging element (84, 132, 150, 158) and an actuator linkage assembly (86, 130, 144, 154); these components together with a pneumatically operated piston (54) within reservoir (50) allows precise on-off operation of the dispenser (10). In the flow-permitting position, the element (84, 132, 150, 158) is adjacent the tube (80).

Abstract: A dispenser (10) for flowable, viscous material (52) is provided which includes a housing (12) comprising a main body (18) and door (20), and a reservoir (50) for the material (52) with an elongated, synthetic resin deformable outlet tube (80) presenting an outlet end (82) coupled to the reservoir (50). A flow-controlling assembly (16) including a tube-engaging element (84, 132, 150, 158) and an actuator linkage assembly (86, 130, 144, 154); these components together with a pneumatically operated piston (54) within reservoir (50) allows precise on-off operation of the dispenser (10). In the flow-permitting position, the element (84, 132, 150, 158) is adjacent the tube (80).