Patents by Inventor Jeremy Weber
Jeremy Weber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250036591Abstract: Systems and methods described herein may relate to data transactions involving a microsector architecture. Control circuitry may organize transactions to and from the microsector architecture to, for example, enable direct addressing transactions as well as batch transactions across multiple microsectors. A data path disposed between programmable logic circuitry of a column of microsectors and a column of row controllers may form a micro-network-on-chip used by a network-on-chip to interface with the programmable logic circuitry.Type: ApplicationFiled: October 10, 2024Publication date: January 30, 2025Inventors: Ilya K. Ganusov, Ashish Gupta, Chee Hak Teh, Sean R. Atsatt, Scott Jeremy Weber, Parivallal Kannan, Aman Gupta, Gary Brian Wallichs
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Patent number: 12164462Abstract: Systems and methods described herein may relate to data transactions involving a microsector architecture. Control circuitry may organize transactions to and from the microsector architecture to, for example, enable direct addressing transactions as well as batch transactions across multiple microsectors. A data path disposed between programmable logic circuitry of a column of microsectors and a column of row controllers may form a micro-network-on-chip used by a network-on-chip to interface with the programmable logic circuitry.Type: GrantFiled: December 23, 2020Date of Patent: December 10, 2024Assignee: ALTERA CORPORATIONInventors: Ilya K. Ganusov, Ashish Gupta, Chee Hak Teh, Sean R. Atsatt, Scott Jeremy Weber, Parivallal Kannan, Aman Gupta, Gary Brian Wallichs
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Patent number: 12003238Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.Type: GrantFiled: August 20, 2021Date of Patent: June 4, 2024Assignee: Intel CorporationInventors: Scott Jeremy Weber, Aravind Raghavendra Dasu, Mahesh A. Iyer, Patrick Koeberl
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Patent number: 11983530Abstract: Systems and methods described herein may relate to providing a dynamically configurable circuitry able to process data associated with a variety of matrix dimensions using one or more complex number operations, one or more real number operations, or both. Configurations may be applied to the configurable circuitry to program the configurable circuitry for a next operation. The configurable circuitry may process data according to a variety of operations based at least in part on operation of a repeated processing element coupled in a compute network of processing elements.Type: GrantFiled: March 27, 2020Date of Patent: May 14, 2024Assignee: Intel CorporationInventors: Sumeet Singh Nagi, Farhana Sheikh, Scott Jeremy Weber, Uneeb Yaqub Rathore
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Patent number: 11901896Abstract: An integrated circuit device includes a programmable logic fabric that has programmable logic circuitry and a partial reconfiguration region. The integrated circuit device also includes a network-on-chip formed in soft logic of the integrated circuit device. Additionally, the network-on-chip is configurable to remain operable during a partial reconfiguration of the partial reconfiguration region.Type: GrantFiled: June 24, 2021Date of Patent: February 13, 2024Assignee: Intel CorporationInventors: Scott Jeremy Weber, Ilya K. Ganusov
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Publication number: 20230333826Abstract: Systems or methods of the present disclosure may provide a library including multiple regional bits streams that may be pre-generated by a manufacturer and/or custom generated by a designer that may be used to implement a design onto an integrated circuit device. The design may be decomposed into one or more regional bitstreams and stitched to form a larger combined bitstream to be implemented as coarse-grained operations on the integrated circuit device, thereby decreasing compilation time experienced by the designer. The combined bitstreams may be loaded into all or a portion of the integrated circuit device to realize the design. Additionally or alternatively, the integrated circuit device may include a hardened networks-on-chip to improve data routing within the combined bitstream.Type: ApplicationFiled: June 20, 2023Publication date: October 19, 2023Inventors: Michael Kinsner, Byron Sinclair, Deshanand P. Singh, Scott Jeremy Weber, Mahesh A. Iyer, Chengping Liang, Victor Tzi-on Zhang, Gabriel Quan
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Publication number: 20230237230Abstract: Systems or methods of the present disclosure may provide a library including multiple personas that may be pre-generated by a manufacturer and/or custom generated by a designer that may be used to implement a design onto an integrated circuit device. The design may be decomposed into one or more personas to be implemented as coarse-grained operations on the integrated circuit device, thereby decreasing compilation time experienced by the designer. The personas may be loaded into one or more regions of the integrated circuit device to realize the design. That is, the design may be realized by one persona may be implemented across multiple regions, one region may be configured by multiple personas, one persona configuring one region, or any combination thereof. Additionally or alternatively, the integrated circuit device may include networks-on-chip to improve data routing between the regions.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Inventors: Michael Kinsner, Byron Sinclair, Deshanand P. Singh, Scott Jeremy Weber, Anandh Venkateswaran, Mahesh A. Iyer
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Publication number: 20220335189Abstract: Systems or methods of the present disclosure may provide a compilation design method that uses cloud computing resources and/or distributed computing resources to compile initial user designs. The initial user design for the programmable logic device may be partitioned into multiple designs for compilation based on periphery logic and core fabric logic. The compilation design method implements partition-level time budgeting and constraint generation using full device timing analysis. The final placed and routed netlist and bitstream SOF is generated by merging the placed and routed netlist and bitstream SOF of individual partition designs.Type: ApplicationFiled: July 1, 2022Publication date: October 20, 2022Inventors: Yi Peng, Scott Jeremy Weber, Mahesh A. Iyer
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Publication number: 20220244867Abstract: Systems or methods of the present disclosure may provide a programmable fabric including programmable logic. The programmable logic may include memory, a network-on-chip (NOC), and at least one micro NOC formed with hardened resources in the programmable fabric. Further, the at least one micro NOC may be communicatively coupled to the NOC and to the programmable logic. Additionally, the at least one micro NOC may selectively route data between the NOC and the programmable logic.Type: ApplicationFiled: April 20, 2022Publication date: August 4, 2022Inventors: Bee Yee Ng, Ilya K. Ganusov, Scott Jeremy Weber
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Publication number: 20220221986Abstract: An integrated circuit device includes a programmable fabric that has a plurality of memory blocks. The integrated circuit device also includes a network-on-chip (NOC) located on a shoreline of the programmable fabric and at least one micro NOC formed with hardened resources in the programmable fabric. The at least one micro NOC is communicatively coupled to the NOC and to at least one memory block of the plurality of memory blocks. Additionally, the at least one micro NOC is configurable to route data between the NOC and the at least one memory block.Type: ApplicationFiled: April 1, 2022Publication date: July 14, 2022Inventors: Scott Jeremy Weber, Ashish Gupta, Navid Azizi, Ilya K. Ganusov, Kalen Brunham, Przemek Guzy, Rajiv Kumar, Thuyet Ngo, Mark Honman
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Publication number: 20220197855Abstract: Systems and methods described herein may relate to data transactions involving a microsector architecture. Control circuitry may organize transactions to and from the microsector architecture to, for example, enable direct addressing transactions as well as batch transactions across multiple microsectors. A data path disposed between programmable logic circuitry of a column of microsectors and a column of row controllers may form a micro-network-on-chip used by a network-on-chip to interface with the programmable logic circuitry.Type: ApplicationFiled: December 23, 2020Publication date: June 23, 2022Inventors: Ilya K. Ganusov, Ashish Gupta, Chee Hak Teh, Sean R. Atsatt, Scott Jeremy Weber, Parivallal Kannan, Aman Gupta, Gary Brian Wallichs
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Publication number: 20210384912Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.Type: ApplicationFiled: August 20, 2021Publication date: December 9, 2021Inventors: Scott Jeremy Weber, Aravind Raghavendra Dasu, Mahesh A. Iyer, Patrick Koeberl
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Publication number: 20210320661Abstract: An integrated circuit device includes a programmable logic fabric that has programmable logic circuitry and a partial reconfiguration region. The integrated circuit device also includes a network-on-chip formed in soft logic of the integrated circuit device. Additionally, the network-on-chip is configurable to remain operable during a partial reconfiguration of the partial reconfiguration region.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Inventors: Scott Jeremy Weber, Ilya K. Ganusov
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Patent number: 11101804Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.Type: GrantFiled: December 11, 2019Date of Patent: August 24, 2021Assignee: Intel CorporationInventors: Scott Jeremy Weber, Aravind Raghavendra Dasu, Mahesh A. Iyer, Patrick Koeberl
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Publication number: 20200225947Abstract: Systems and methods described herein may relate to providing a dynamically configurable circuitry able to process data associated with a variety of matrix dimensions one or more complex number operations, one or more real number operations, or both. Configurations may be applied to the configurable circuitry to program the configurable circuitry for a next operation. The configurable circuitry may process data according to a variety of operations based at least in part on operation of a repeated processing element coupled in a compute network of processing elements.Type: ApplicationFiled: March 27, 2020Publication date: July 16, 2020Inventors: Sumeet Singh Nagi, Farhana Sheikh, Scott Jeremy Weber, Uneeb Yaqub Rathore
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Publication number: 20200119736Abstract: An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces as well as compute elements that may also be application-specific. The memory in the base die may be directly accessed by the programmable fabric die using a low-latency, high capacity, and high bandwidth interface.Type: ApplicationFiled: December 11, 2019Publication date: April 16, 2020Inventors: Scott Jeremy Weber, Aravind Raghavendra Dasu, Mahesh A. Iyer, Patrick Koebert
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Publication number: 20190002607Abstract: A method for producing highly reactive olefin polymers wherein at least 50 mol. % of the polymer chains have terminal double bonds, from an impurity-containing isobutylene or a mixed C4 hydrocarbyl feedstock containing isobutylene in which the water content of the feedstock is controlled to be at least equal to the content of polar impurities in the feedstock, and less than the concentration at which the water causes a decrease in vinylidene end-group selectivity.Type: ApplicationFiled: June 28, 2017Publication date: January 3, 2019Inventors: Philip Dimitrov, Richard J. Severt, Thomas Skourlis, Jeremy Weber, Jacob Emert, Rudolf Faust
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Patent number: 10167352Abstract: A method for producing highly reactive olefin polymers wherein at least 50 mol. % of the polymer chains have terminal double bonds, from an impurity-containing isobutylene or a mixed C4 hydrocarbyl feedstock containing isobutylene in which the water content of the feedstock is controlled to be at least equal to the content of polar impurities in the feedstock, and less than the concentration at which the water causes a decrease in vinylidene end-group selectivity.Type: GrantFiled: June 28, 2017Date of Patent: January 1, 2019Assignees: University of Massachusetts, Infineum International LimitedInventors: Philip Dimitrov, Richard J. Severt, Thomas Skourlis, Jeremy Weber, Jacob Emert, Rudolf Faust
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Patent number: 10047174Abstract: A method for producing highly reactive olefin polymers wherein at least 50 mol. % of the polymer chains have terminal double bonds, from an isobutylene or a mixed C4 hydrocarbyl feedstock containing isobutylene. To achieve a viable process, water is added to the catalyst stream or the feedstock in the overall range of 0.05 mM to less than 5 mM per liter of feedstock.Type: GrantFiled: June 28, 2017Date of Patent: August 14, 2018Assignee: INFINEUM INTERNATIONAL LIMITEDInventors: Philip Dimitrov, Richard J. Severt, Thomas Skourlis, Jeremy Weber, Jacob Emert
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Publication number: 20130332858Abstract: One aspect provides a loop based social networking site. An embodiment provides for loops, a loop comprising a list or group of registered users bound together as an electronic group, and provides a mechanism of pushing communications to members of a loop. As such, on joining as a member of a particular loop, the loop member will have events of the loop automatically pushed to the user's personal or individual loop site, including in some cases automatic addition of the event to the personal calendar of the loop member. In this way, a loop can ensure that each member has received particular communications. Each loop member consents to accepting loop information/communications by virtue of joining the loop. Other aspects are described and claimed.Type: ApplicationFiled: June 10, 2013Publication date: December 12, 2013Inventors: Jeremy Weber, Nathan Weber