Patents by Inventor Jeric Sarad

Jeric Sarad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate structure with spatial arrangement configured for coupling of surface plasmons to incident light
    Patent number: 10510675
    Abstract: Embodiments of the disclosure provide a substrate structure for an integrated circuit (IC) structure, including: a first dielectric layer positioned above a semiconductor substrate; a first plurality of trenches extending at least partially into the first dielectric layer from an upper surface of the first dielectric layer; and a first metal formed within the first plurality of trenches, wherein a spatial arrangement of the first plurality of trenches causes coupling of surface plasmons in the first metal to at least one wavelength of an incident light.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: December 17, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Somnath Ghosh, Eswar Ramanathan, Qanit Takmeel, Ming He, Jeric Sarad, Ashwini Chandrashekar, Colin Bombardier, Anbu Selvam KM Mahalingam, Keith P. Donegan, Prakash Periasamy
  • SUBSTRATE STRUCTURE WITH SPATIAL ARRANGEMENT CONFIGURED FOR COUPLING OF SURFACE PLASMONS TO INCIDENT LIGHT
    Publication number: 20190244911
    Abstract: Embodiments of the disclosure provide a substrate structure for an integrated circuit (IC) structure, including: a first dielectric layer positioned above a semiconductor substrate; a first plurality of trenches extending at least partially into the first dielectric layer from an upper surface of the first dielectric layer; and a first metal formed within the first plurality of trenches, wherein a spatial arrangement of the first plurality of trenches causes coupling of surface plasmons in the first metal to at least one wavelength of an incident light.
    Type: Application
    Filed: February 5, 2018
    Publication date: August 8, 2019
    Inventors: Somnath Ghosh, Eswar Ramanathan, Qanit Takmeel, Ming He, Jeric Sarad, Ashwini Chandrashekar, Colin Bombardier, Anbu Selvam KM Mahalingam, Keith P. Donegan, Prakash Periasamy