Patents by Inventor Jericho Jacala

Jericho Jacala has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density flip chip interconnections
    Publication number: 20050277226
    Abstract: A printed circuit board has, on one surface thereof, a plurality of metallic pads forming or leading to wire traces. The printed circuit board surface is solder mask free and a substantially runless soldering alloy is used to connect I/O solder bumps on a flip chip to the metallic pads.
    Type: Application
    Filed: May 28, 2004
    Publication date: December 15, 2005
    Inventors: Yinon Degani, Jericho Jacala