Abstract: The present invention relates generally to LED (light emitting diode) array assemblies, and more specifically, to hi-powered LED array assemblies which are compact, cost-effective and easily assembled, while still addressing the issue of thermal management in such systems. An improved LED array assembly is described which is compact, cost-effective and easily assembled, while still addressing the issue of thermal management. An exemplary LED assembly consists of four separate and independent printed circuit boards (PCBs) which are arranged in an elongated square prism on a base PCB to form a “tower”, the four PCBs being mechanically interconnected by means of complementary slots and tabs. Each of the vertically arranged PCBs supports and provides power to one or more LEDs. Other aspects of the invention are also described including a flared base, drainage openings, and retaining notches on the perimeter of the PCB tower.

Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.

Abstract: The present disclosure describes light systems in which the intensity of base color LEDs configured to emit light within a target color region is increased using additional white LEDs and the emitted light is filtered so that a dominant portion of light passing through the filter at a particular viewing angle is within the target color region. The present disclosure also describes methods for forming a printed circuit board with an integral heat sink arrangement by depositing additional solder on solder pads that are not used to connect electronic components so that the additional solder acts as a heat sink.