Patents by Inventor Jermyn Tseng

Jermyn Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250125776
    Abstract: A radio-frequency integrated circuit can be protected by a clamp circuit configured to provide electrostatic discharge protection and surge protection for either or both of an amplifier and a related controller. The clamp circuit can include a feedback combination clamp implemented to direct a current associated with either or both of an electrostatic discharge and a surge at a first node to a second node.
    Type: Application
    Filed: August 13, 2024
    Publication date: April 17, 2025
    Inventors: Myunghwan PARK, Jermyn TSENG, John Tzung-Yin LEE, David Steven RIPLEY
  • Patent number: 12063014
    Abstract: Amplifier having electrostatic discharge and surge protection circuit. In some embodiments, a radio-frequency integrated circuit can include an amplifier, a controller configured to control operation of the amplifier, and a clamp circuit configured to provide electrostatic discharge protection and surge protection for either or both of the amplifier and the controller. The clamp circuit can include a feedback combination clamp implemented to direct a current associated with either or both of an electrostatic discharge and a surge at a first node to a second node.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: August 13, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Myunghwan Park, Jermyn Tseng, John Tzung-Yin Lee, David Steven Ripley
  • Publication number: 20220320343
    Abstract: A transistor can include a source and a drain with each implemented in a first type active region, a gate implemented relative to the source and the drain, and a body implemented in the first type active region and substantially covered by the gate. The transistor can further include a body tie implemented in a second type active region and including a connecting portion substantially covered by the gate and engaging the body. The first and second active regions can be dimensioned to provide a gap therebetween on each side of the gate.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 6, 2022
    Inventor: Jermyn TSENG
  • Publication number: 20220140792
    Abstract: Amplifier having electrostatic discharge and surge protection circuit. In some embodiments, a radio-frequency integrated circuit can include an amplifier, a controller configured to control operation of the amplifier, and a clamp circuit configured to provide electrostatic discharge protection and surge protection for either or both of the amplifier and the controller. The clamp circuit can include a feedback combination clamp implemented to direct a current associated with either or both of an electrostatic discharge and a surge at a first node to a second node.
    Type: Application
    Filed: January 20, 2022
    Publication date: May 5, 2022
    Inventors: Myunghwan PARK, Jermyn TSENG, John Tzung-Yin LEE, David Steven RIPLEY
  • Patent number: 11233486
    Abstract: Concurrent electrostatic discharge and surge protection clamps in power amplifiers. In some embodiments, a semiconductor die can include a semiconductor substrate and an integrated circuit implemented on the semiconductor substrate. The integrated circuit can include a power amplifier and a controller. The semiconductor die can further include a clamp circuit implemented on the semiconductor substrate and configured to provide electrostatic discharge protection and surge protection for at least some of the integrated circuit.
    Type: Grant
    Filed: February 1, 2020
    Date of Patent: January 25, 2022
    Assignee: Skyworks Solutions, Inc.
    Inventors: Myunghwan Park, Jermyn Tseng, John Tzung-Yin Lee, David Steven Ripley
  • Publication number: 20200321923
    Abstract: Concurrent electrostatic discharge and surge protection clamps in power amplifiers. In some embodiments, a semiconductor die can include a semiconductor substrate and an integrated circuit implemented on the semiconductor substrate. The integrated circuit can include a power amplifier and a controller. The semiconductor die can further include a clamp circuit implemented on the semiconductor substrate and configured to provide electrostatic discharge protection and surge protection for at least some of the integrated circuit.
    Type: Application
    Filed: February 1, 2020
    Publication date: October 8, 2020
    Inventors: Myunghwan PARK, Jermyn TSENG, Tzung-Yin LEE, David Steven RIPLEY
  • Patent number: 10109364
    Abstract: A non-volatile memory cell, having an antifuse for storing data, is disclosed for use in a non-volatile data storage device. The non-volatile memory cell includes multiple redundant signal pathways to provide redundant access to the antifuse. During operation, the non-volatile memory cell can access the antifuse using a first signal pathway from among the multiple redundant signal pathways. However, when the first signal pathway is inoperable, the non-volatile memory cell is able to access the antifuse using a second signal pathway from among the multiple redundant signal pathways. The non-volatile memory cell is fabricated using a continuous region of one or more diffusion layers to allow efficient connection to other non-volatile memory cells to form an array of memory cells for the non-volatile data storage device.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: October 23, 2018
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Jonathan A. Schmitt, Jermyn Tseng
  • Publication number: 20170117058
    Abstract: A non-volatile memory cell, having an antifuse for storing data, is disclosed for use in a non-volatile data storage device. The non-volatile memory cell includes multiple redundant signal pathways to provide redundant access to the antifuse. During operation, the non-volatile memory cell can access the antifuse using a first signal pathway from among the multiple redundant signal pathways. However, when the first signal pathway is inoperable, the non-volatile memory cell is able to access the antifuse using a second signal pathway from among the multiple redundant signal pathways. The non-volatile memory cell is fabricated using a continuous region of one or more diffusion layers to allow efficient connection to other non-volatile memory cells to form an array of memory cells for the non-volatile data storage device.
    Type: Application
    Filed: October 28, 2015
    Publication date: April 27, 2017
    Applicant: Broadcom Corporation
    Inventors: Jonathan A. Schmitt, Jermyn Tseng