Patents by Inventor Jern Sern Lew

Jern Sern Lew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEALING STRUCTURE FOR WORKPIECE TO SUBSTRATE BONDING IN A PROCESSING CHAMBER
    Publication number: 20160064267
    Abstract: A sealing structure is between a workpiece or substrate and a carrier for plasma processing. In one example, a substrate carrier has a top surface for holding a substrate, the top surface having a perimeter and a resilient sealing ridge on the perimeter of the top surface to contact the substrate when the substrate is being carried on the carrier.
    Type: Application
    Filed: January 22, 2015
    Publication date: March 3, 2016
    Inventors: Chin Hock Toh, Tuck Foong Koh, Sriskantharajah Thirunavukarasu, Jern Sern Lew, Arvind Sundarrajan, Seshadri Ramaswami