Abstract: A substrate handling system is disclosed. The substrate handling system comprises a substrate handling robot for transferring a substrate among a plurality of substrate stations; and a lidar imaging system comprising a lidar image acquisition module located on the substrate handling robot, the lidar imaging system being configured to acquire at least one 3D image of a substrate and/or a substrate station, and to determine one or more properties of the substrate and/or the substrate station, based on the at least one 3D image.

Abstract: The disclosure relates to a flange for a process tube in an apparatus for processing substrates, e.g., a vertical furnace. The flange may be provided with an opening for in use giving access to the process chamber of the process tube and a cooling channel for allowing a cooling fluid to flow there through and cool the flange. A material with a heat conductivity between 0.1 and 40 W/m K may be at least partially provided in between the cooling fluid and the rest of the flange.

Abstract: The disclosure relates to a flange for a process tube in an apparatus for processing substrates, e.g., a vertical furnace. The flange may be provided with an opening for in use giving access to the process chamber of the process tube and a cooling channel for allowing a cooling fluid to flow there through and cool the flange. A material with a heat conductivity between 0.1 and 40 W/m K may be at least partially provided in between the cooling fluid and the rest of the flange.

Abstract: The disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall. The system may further comprise a processing module and a cassette module, the cassette module located adjacent the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronics components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.

Abstract: A glass panel assembly for use in a roof of a vehicle, comprises a glass panel, a frame and an elongate lighting device. The glass panel comprises an interior main surface and the interior main surface of the glass panel is configured to be directed to a passenger compartment of the vehicle. The frame is adhered to the interior main surface and comprises a shaped element. The shaped element is one of a recess and a protrusion. The elongate lighting device is coupled to the frame by a mating shape engaging the shaped element. The lighting device is configured to directly illuminate at least a part of said passenger compartment.

Abstract: The disclosure relates to a substrate processing apparatus for processing a plurality of substrates. The apparatus comprising a reactor mounted in the apparatus and configured for processing substrates and a reactor mover for moving the reactor for maintenance. The reactor mover is constructed and arranged with a lift to move the reactor to a lower height to allow for access to the reactor by a maintenance worker.

Abstract: The disclosure relates to a flange for a process tube in an apparatus for processing substrates, e.g., a vertical furnace. The flange may be provided with an opening for in use giving access to the process chamber of the process tube and a cooling channel for allowing a cooling fluid to flow there through and cool the flange. A material with a heat conductivity between 0.1 and 40 W/m K may be at least partially provided in between the cooling fluid and the rest of the flange.

Abstract: The disclosure relates to a semiconductor processing system for processing semiconductor substrates and provided with a housing formed by a wall. The system may further comprise a processing module and a cassette module, the cassette module located adjacent the processing module. An electronics module may be provided with a support for mounting electronic components, whereby the electronics module is located behind a door in the wall of the system to create access for maintenance. The electronic components have a straight mounting basis for mounting of the electronics components whereby the mounting basis is mounted in the system under an angle between 10 and 80 degrees with respect to the door when the door is closed.

Abstract: A glass panel assembly for use in a roof of a vehicle, comprises a glass panel, a frame and an elongate lighting device. The glass panel comprises an interior main surface and the interior main surface of the glass panel is configured to be directed to a passenger compartment of the vehicle. The frame is adhered to the interior main surface and comprises a shaped element. The shaped element is one of a recess and a protrusion. The elongate lighting device is coupled to the frame by a mating shape engaging the shaped element. The lighting device is configured to directly illuminate at least a part of said passenger compartment.

Abstract: A glass panel assembly for use in a roof of a vehicle, comprises a glass panel, a frame and an elongate lighting device. The glass panel comprises an interior main surface and the interior main surface of the glass panel is configured to be directed to a passenger compartment of the vehicle. The frame is adhered to the interior main surface and comprises a shaped element. The shaped element is one of a recess and a protrusion. The elongate lighting device is coupled to the frame by a mating shape engaging the shaped element. The lighting device is configured to directly illuminate at least a part of said passenger compartment.

Abstract: A system and a method for installing a semiconductor manufacturing apparatus comprising several modules, each of which is provided with a number of module supporting feet at a bottom side. The system and the method comprise a supporting point reduction frame, having an upper side and a bottom side, said frame at the upper side being provided with a number of first supporting points, such that each foot of a module of said semiconductor manufacturing apparatus corresponds with a first supporting point, said supporting point reduction frame at the bottom side being provided with a number of second supporting points, whereby the total number of module supporting feet exceeds said number of second supporting points, and the stiffness of said supporting point reduction frame being such that, during transportation, deviations in the relative positions of the modules mounted on said supporting point reduction frame remain within specified transportation limits.