Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.

Abstract: Systems and methods for cooling an objective lens of a charged-particle beam system are disclosed. According to certain embodiments, the method for cooling an objective lens of a charged-particle beam system comprises receiving a fluid via a fluid input port of a bobbin, circulating the fluid that absorbs heat generated by a plurality of electromagnetic coils of the objective lens, via a plurality of channels distributed in the bobbin, and dispensing the fluid circulated by the plurality of channels via a fluid output port of the bobbin. The bobbin may further comprise a bottom flange proximal to a wafer and a top flange distal from the wafer. The bobbin having the plurality of channels may comprise an additively manufactured monolithic structure.

Abstract: An apparatus for use in a metrology process or a lithographic process, the apparatus including: an object support module adapted to hold an object; and a first gas shower arranged on a first side of the object support module and adapted to emit a gas with a first velocity in a first gas direction which is a horizontal direction to cause a net gas flow in the apparatus to be a substantially horizontal gas flow in the first gas direction at least above the object support module.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Abstract: An apparatus having: a vacuum chamber for enclosing an article support, the article support configured to support an article such that a volume is defined between the article support and the article, the article support including a plurality of supporting protrusions configured to provide a plane of support for the article; a conduit for providing a fluid to the volume such that the fluid provides heat transfer between the article and the article support; and a controller for controlling the fluid supply to the volume, wherein the controller is configured to control a fluid supply unit to start removing the fluid substantially at a time the article reaches a stable temperature.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.

Abstract: A pressure control valve has: a passageway having a flow opening; an member displaceable relative to the opening for obstructing the opening by differing amounts; a piezo actuator; and a linkage mechanism adapted to amplify a dimensional change in the piezo actuator and to use the amplified dimensional change to displace the member relative to the opening, wherein the linkage mechanism comprises a frame attached to a wall and fixed at a first end in relation to the passageway, a portion of the frame moveable in a first direction while being substantially restrained in a second direction orthogonal to the first direction, the piezo actuator extending between the wall and the movable portion such that an expansion of the piezo actuator results in movement of the movable portion in the first direction by an amount greater than the expansion of the piezo actuator, the moveable portion connected to the member.

Abstract: A pressure control valve has: a passageway having a flow opening; an member displaceable relative to the opening for obstructing the opening by differing amounts; a piezo actuator; and a linkage mechanism adapted to amplify a dimensional change in the piezo actuator and to use the amplified dimensional change to displace the member relative to the opening, wherein the linkage mechanism comprises a frame attached to a wall and fixed at a first end in relation to the passageway, a portion of the frame moveable in a first direction while being substantially restrained in a second direction orthogonal to the first direction, the piezo actuator extending between the wall and the movable portion such that an expansion of the piezo actuator results in movement of the movable portion in the first direction by an amount greater than the expansion of the piezo actuator, the moveable portion connected to the member.

Abstract: An e-beam inspection tool is disclosed, the tool comprising, an electron optics system configured to generate an electron beam, an object table configured to hold a specimen, a positioning device configured to position the object table, the positioning device comprising an actuator, wherein the positioning device further comprises a heating device configured to generate a heat load and a heat load controller to control the generated heat load at least partly based on an actuator heat load generated in the actuator.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.

Abstract: An apparatus having: a vacuum chamber for enclosing an article support, the article support configured to support an article such that a volume is defined between the article support and the article, the article support including a plurality of supporting protrusions configured to provide a plane of support for the article; a conduit for providing a fluid to the volume such that the fluid provides heat transfer between the article and the article support; and a controller for controlling the fluid supply to the volume, wherein the controller is configured to control a fluid supply unit to start removing the fluid substantially at a time the article reaches a stable temperature.

Abstract: An e-beam inspection tool is disclosed, the tool comprising, an electron optics system configured to generate an electron beam, an object table configured to hold a specimen, a positioning device configured to position the object table, the positioning device comprising an actuator, wherein the positioning device further comprises a heating device configured to generate a heat load and a heat load controller to control the generated heat load at least partly based on an actuator heat load generated in the actuator.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.

Abstract: A pressure control valve has: a passageway having a flow opening; an member displaceable relative to the opening for obstructing the opening by differing amounts; a piezo actuator; and a linkage mechanism adapted to amplify a dimensional change in the piezo actuator and to use the amplified dimensional change to displace the member relative to the opening, wherein the linkage mechanism comprises a frame attached to a wall and fixed at a first end in relation to the passageway, a portion of the frame moveable in a first direction while being substantially restrained in a second direction orthogonal to the first direction, the piezo actuator extending between the wall and the movable portion such that an expansion of the piezo actuator results in movement of the movable portion in the first direction by an amount greater than the expansion of the piezo actuator, the moveable portion connected to the member.

Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including an improved load lock unit is disclosed. An improved load lock system may comprise a plurality of supporting structures configured to support a wafer and a conditioning plate including a heat transfer element configured to adjust a temperature of the wafer. The load lock system may further comprise a gas vent configured to provide a gas between the conditioning plate and the wafer and a controller configured to assist with the control of the heat transfer element.

Abstract: A lithographic apparatus including a barrier system and a device manufacturing method using such a lithographic apparatus. The barrier system is used to maintain a protected volume of gas within a barrier. The protected volume may be maintained when different components of the lithographic apparatus move relative to each other. The barrier system may be used in different locations within the lithographic apparatus. The geometry of the barrier affects how efficiently the protected volume is maintained, especially at high speeds. The geometry reduces the amount of ambient gas entering the protected volume from outside the barrier.