Patents by Inventor Jeroen Iedema

Jeroen Iedema has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11129276
    Abstract: A socket assembly comprises a base frame formed of a thermally conductive material holding a light emitting diode (LED) package to a support structure, a contact element electrically contacting the LED package, and an isolator PCB. The LED package includes an LED PCB having an LED mounted on the LED PCB. The base frame includes a base mounted to the support structure and mechanically engaging the LED PCB so that the LED package is attached to the support structure with a predetermined holding force. The contact element electrically connects the isolator PCB to the LED PCB. The isolator PCB supplies electrical power to the LED. The isolator PCB has a first surface and a second surface; the second surface is in heat transmitting contact with the base frame and the electronic component is disposed on the first surface of the isolator PCB and electrically connected to the LED.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: September 21, 2021
    Assignees: TE Connectivity Nederland BV, Tyco Electronics UK Ltd
    Inventors: Jeroen Iedema, Olaf Leijnse, Peter Poorter, Jonathan Catchpole
  • Patent number: 10527260
    Abstract: A clamp for a socket assembly is disclosed. The clamp comprises an upper plate, a lower plate arranged parallel to the upper plate, and a pressing section connected to the upper plate. The upper plate is capable of being pressed toward the lower plate.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: January 7, 2020
    Assignee: TE Connectivity Nederland BV
    Inventors: Peter Poorter, Olaf Leijnse, Jeroen Iedema, Alessandro Bernadi
  • Publication number: 20190008045
    Abstract: A socket assembly comprises a base frame formed of a thermally conductive material holding a light emitting diode (LED) package to a support structure, a contact element electrically contacting the LED package, and an isolator PCB. The LED package includes an LED PCB having an LED mounted on the LED PCB. The base frame includes a base mounted to the support structure and mechanically engaging the LED PCB so that the LED package is attached to the support structure with a predetermined holding force. The contact element electrically connects the isolator PCB to the LED PCB. The isolator PCB supplies electrical power to the LED. The isolator PCB has a first surface and a second surface; the second surface is in heat transmitting contact with the base frame and the electronic component is disposed on the first surface of the isolator PCB and electrically connected to the LED.
    Type: Application
    Filed: September 10, 2018
    Publication date: January 3, 2019
    Applicants: TE Connectivity Nederland BV, Tyco Electronics UK Ltd
    Inventors: Jeroen Iedema, Olaf Leijnse, Peter Poorter, Jonathan Catchpole
  • Patent number: 10066813
    Abstract: A socket assembly is disclosed. The socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB), a base frame, an isolator frame, and an electrical contact. The base frame has a base mounted to a support structure and a spring finger extending from the base, the spring finger applying a clamping force to the LED PCB that acts in a direction toward the support structure. The isolator frame is mounted to the support structure. The electrical contact is electrically connected to the LED PCB and disposed within the isolator frame, such that the isolator frame electrically isolates the base frame from the electrical contact.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: September 4, 2018
    Assignee: TE Connectivity Nederland BV
    Inventors: Peter Poorter, Jeroen Iedema, Olaf Leijnse
  • Publication number: 20160377266
    Abstract: A clamp for a socket assembly is disclosed. The clamp comprises an upper plate, a lower plate arranged parallel to the upper plate, and a pressing section connected to the upper plate. The upper plate is capable of being pressed toward the lower plate.
    Type: Application
    Filed: September 12, 2016
    Publication date: December 29, 2016
    Applicant: TE Connectivity Nederland BV
    Inventors: Peter Poorter, Olaf Leijnse, Jeroen Iedema, Alessandro Bernadi
  • Publication number: 20160312984
    Abstract: A socket assembly is disclosed. The socket assembly includes a light emitting diode (LED) package having an LED printed circuit board (PCB), a base frame, an isolator frame, and an electrical contact. The base frame has a base mounted to a support structure and a spring finger extending from the base, the spring finger applying a clamping force to the LED PCB that acts in a direction toward the support structure. The isolator frame is mounted to the support structure. The electrical contact is electrically connected to the LED PCB and disposed within the isolator frame, such that the isolator frame electrically isolates the base frame from the electrical contact.
    Type: Application
    Filed: July 1, 2016
    Publication date: October 27, 2016
    Applicant: TE Connectivity Nederland BV
    Inventors: Peter Poorter, Jeroen Iedema, Olaf Leijnse