Abstract: An electronic device is disclosed. The electronic device can include an electronic component. The electronic device can include a shaped body in which the electronic component is at least partially embedded, the shaped body comprising a base portion and a plurality of heat-dissipating projections extending outwardly therefrom. In some embodiments, the electronic device can include a passive electronic device, such as an inductor or transformer.

Abstract: Methods, systems, and apparatuses for integrated circuit packages, such as ball grid array packages, and processes for assembling the same, are provided. A first strip includes an array of package substrate sections. An IC die is mounted to each package substrate section of the first strip. A second strip includes an array of leadframe sections. The second strip is positioned adjacent to the first strip to couple a planar protruding area of each leadframe section to a corresponding IC die mounted to the first strip. An encapsulating material is applied to the adjacently positioned first and second strips to fill a space between the first and second strips and to fill a cavity in a top surface of each leadframe section. A planar region of the first strip surrounding each centrally located cavity is not covered by the encapsulating material. The adjacently positioned first and second strips are singulated into a plurality of IC packages.

Abstract: Methods, systems, and apparatuses for integrated circuit packages, such as ball grid array packages, and processes for assembling the same, are provided. A first strip includes an array of package substrate sections. An IC die is mounted to each package substrate section of the first strip. A second strip includes an array of leadframe sections. The second strip is positioned adjacent to the first strip to couple a planar protruding area of each leadframe section to a corresponding IC die mounted to the first strip. An encapsulating material is applied to the adjacently positioned first and second strips to fill a space between the first and second strips and to fill a cavity in a top surface of each leadframe section. A planar region of the first strip surrounding each centrally located cavity is not covered by the encapsulating material. The adjacently positioned first and second strips are singulated into a plurality of IC packages.

Abstract: A high bandwidth operational amplifier architecture has three control loops, which are combined via a voltage-follower-configured field effect transistor. The first control loop is an instantaneous main amplification path and employs positive feedback-based Vgs correction of the output transistor. The second control loop has a bandwidth considerably lower than the first loop and employs negative feedback to correct for long term drift errors. The third control loop, utilizing negative feedback, is a fast path having a bandwidth that overlaps the bandwidth of the first control loop, and corrects for overshoot and undershoot in the main amplification path.

Abstract: The present invention, generally speaking, allows for a substantial reduction in oscillator phase noise by modifying the transfer function of a portion of the oscillator, e.g., by adding a zero to the transfer function. Modifying the transfer function reduces the open-loop gain of the oscillator but achieves a desired phase compensation, allowing the oscillator to be operated at the resonance of the resonator instead of off resonance. In an exemplary embodiment, the transfer function is modified by choosing a capacitance value such that, instead of operating as a bypass at the frequency of interest, adds a zero to the transfer function of the oscillator and causes a change in frequency characteristics, achieving an increase in the effective Q of the oscillator. This increase in effective Q translates directly into reduced phase noise. Phase noise improvement in the range of 3dB has been demonstrated.