Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: In a system for making walls, at least two pairs of connector plates are provided, each including receptacle for receiving an end of a structural member. At least one spacer plate is located between and rotatably coupled to successively positioned connector plates. To form a wall, a pair of connector plates is coupled via the retaining means, one to each of a pair of generally opposing ends defined by structural members. The connector plates are rotatably movable relative to the spacer plates thereby allowing the structural members to be oriented relative to one another so as to form a surface having desired contours.

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

Abstract: In a system for making walls, at least two pairs of connector plates are provided, each including receptacle for receiving an end of a structural member. At least one spacer plate is located between and rotatably coupled to successively positioned connector plates. To form a wall, a pair of connector plates is coupled via the retaining means, one to each of a pair of generally opposing ends defined by structural members. The connector plates are rotatably movable relative to the spacer plates thereby allowing the structural members to be oriented relative to one another so as to form a surface having desired contours.

Abstract: In an apparatus for making foundation walls having angled or arcuate contours first and second connecting members are provided. Each connecting member defines at least one joining portion, the connecting members being attachable to a foundation form. When foundation forms are positioned adjacent to one another the joining portions defined by each of the connecting members interlock with one another. An elongating coupling member defining an exterior shape complementary to a shape defined by passages extending through the joining portions is positioned in these passages to rotatably and releasably join the first and second connecting members and thereby the foundation forms together.

Abstract: The present invention is directed toward a system and method for administering incentive offers. A system for administering incentive offers includes a centralized repository for storing offer information, a maintenance engine for updating and maintaining the offer information in the repository, and a retrieval engine for finding and retrieving offers. The system cooperates with an offer presentation engine for configuring and presenting offers based on offeree traits and the environment in which the offer is to be presented. An exemplary system formulates tests to determine effects of changes in content or context, tracks events related to presentation and acceptance of offers, evaluates impact of offer changes on offer effectiveness, and predicts optimum offer content and context based on results of such tests.

Abstract: A food container fabricated from a one piece paperboard blank suitable for packaging pizza pies and the like where the container includes a tear tab which is convertible into a support for maintaining the integrity of the container.

Abstract: A method of manufacturing a silicon gate MIS device providing automatic formation and alignment of the gate structure during formation of adjacent impurity regions. In a preferred embodiment, the process is for the gate structure and source and drain of silicon gate FETs. The layered gate constituents-- typically oxide and silicon-- are formed on a semiconductor wafer. A photoresist mask which is larger than the desired gate size is formed on the silicon and the silicon is etched to a predetermined size beneath the overhanging mask. A deposition mask in the form of the photoresist mask or the gate silicon oxide and which is of the same size as the photoresist mask, is used to control the deposition of impurities within predetermined surface areas of the substrate which are spaced a predetermined distance from the silicon gate boundaries.

Abstract: An adhesion-enhancing technique for preparing the surface of a polycrystalline silicon body to receive organic photoresist. In an exemplary procedure, the polysilicon is placed in an oxygen plasma chamber operating under rf power of about 90 milliwatts per cubic centimeter of chamber volume and a pressure of approximately 1 torr for 10 minutes to form an adhesion-enhancing oxide monolayer on the polysilicon.