Abstract: An aspect of the present disclosure relates to a microsampler for hermetically sealing a sample. In particular, such microsamplers can be useful for encapsulation of chemical, biological, and explosive samples for the purposes of archival sample storage. Methods of making and using such microsamplers are also described herein.

Abstract: Whisker growth can be prevented in tin coatings by altering the tin film composition) or by modifying the tin/substrate interface.

Abstract: A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0<x<5 percent by weight based on the weight of tin effective to depress the melting point of the tin-silver composition to a desired level. Melting point ranges from about 218.degree. C. down to about 205.degree. C. depending an the amount of bismuth added to the eutectic tin-silver alloy as determined by DSC analysis, 10.degree. C./min. A preferred alloy composition is 91.84Sn-3.33Ag-4.83Bi (weight percent based on total alloy weight).