Abstract: Methods and systems herein can efficiently interconnect processors through a custom grid (a data mesh) utilizing upper metal layer routing in a semiconductor die design to minimize latency. A computer-implemented method of routing interconnects on a semiconductor die includes receiving a set of non-default routes and associated routing rules; identifying a set of critical signals for feedthrough on the set of non-default routes; generating a connectivity matrix including a set of resulting routes, the resulting routes routing the set of critical signals through the set of non-default routes; generating a timing analysis of the connectivity matrix based on a set of latency requirements; responsive to determining that the timing analysis is not compliant with the latency requirements, generating a set of routing constraints; and updating the associated routing rules to include the set of routing constraints.

Abstract: A method and apparatus for dispensing and retrieving products is provided. An apparatus may include: a plurality of shelf units. Each shelf unit extends longitudinally between a first end and a second end. The first end may be configured to receive articles, and the second end may be configured to present articles for retrieval in a retrieval position. Each of the plurality of shelf units is arranged with a respective second end facing a retrieval area. Each of the plurality of shelf units is inclined with the first end being lower than the second end. The apparatus may also include a retrieval device comprising an end-of-arm tool. The retrieval device is disposed within the retrieval area and configured to attach the end-of-arm tool to an article in a retrieval position of each of the plurality of shelf units.

Abstract: A method and apparatus for dispensing and retrieving products is provided. An apparatus may include: a plurality of shelf units. Each shelf unit extends longitudinally between a first end and a second end. The first end may be configured to receive articles, and the second end may be configured to present articles for retrieval in a retrieval position. Each of the plurality of shelf units is arranged with a respective second end facing a retrieval area. Each of the plurality of shelf units is inclined with the first end being lower than the second end. The apparatus may also include a retrieval device comprising an end-of-arm tool. The retrieval device is disposed within the retrieval area and configured to attach the end-of-arm tool to an article in a retrieval position of each of the plurality of shelf units.

Abstract: The present invention relates to a resolution process of (±)-methyl phenyl[4-[4-[[[4?-(trifluoromethyl)-2-biphenylyl]carbonyl]amino]phenyl]-1-piperidinyl]acetate to isolate the MTP (microsomal triglyceride transfer protein) inhibitor methyl (2S)-phenyl[4-[4-[[[4?-(trifluoromethyl)-2-biphenylyl]carbonyl]amino]phenyl]-1-piperidinyl]acetate and an epimerisation procedure for racemizing methyl (2R)-phenyl[4-[4-[[[4?-(trifluoromethyl)-2-biphenylyl]carbonyl]amino]phenyl]-1-piperidinyl]acetate.

Abstract: The present invention relates to a resolution process of (±)-methyl phenyl[4-[4-[[[4?-(trifluoromethyl)-2-biphenylyl]carbonyl]amino]phenyl]-1-piperidinyl]acetate to isolate the MTP (microsomal triglyceride transfer protein) inhibitor methyl (2S)-phenyl[4-[4-[[[4?-(trifluoromethyl)-2-biphenylyl]carbonyl]amino]phenyl]-1-piperidinyl]acetate and an epimerisation procedure for racemizing methyl (2R)-phenyl[4-[4-[[[4?-(trifluoromethyl)-2-biphenylyl]carbonyl]amino]phenyl]-1-piperidinyl]acetate.

Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film.

Abstract: A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact.

Abstract: Method and apparatus for fabricating fine pitch pattern multilayer printed circuit boards involving laminar stackable board layers providing power distribution, signal distribution and capacitive decoupling. In one respect, the invention relates to the fabrication of board layers by beginning with a metallic core, patterning the core, selectively enclosing the core in a dielectric, selectively depositing metal to form vias, plugs and signal lines, and forming dendrites with joining metallurgy on the vias and plugs to provide stackable connection from above or below the plane of the board layer. In another aspect, the invention is directed to the use of a sol-gel process to form a thin high dielectric constant crystalline film onto a metallic sheet followed with a deposition of a metallic layer onto the high dielectric constant film.

Abstract: A parking brake assembly includes a lever that translates pivoting rotation to sliding movement of a tappet in contact with a braking shoe to effect expansion of the brake shoe against the inside diameter of a rotating element. The rotating element is, in more specificity, a rotor carried by a spindle that is rotatably supported by bearings. The bearings are carried by the actuator housing which additionally carries the lever and tappet of the parking brake assembly.

Abstract: A socket for attaching a flip chip die or ball grid array devices to a printed circuit board substrate having a pattern of solder covered lands, with resources for removing the flip chip die or ball grid array device, resources for directly aligning the solder balls of the flip chip die or ball grid array device to the printed circuit board, resources for using an interposer of dendrite coated vias or pads to electrically and physically connect the solder balls of the flip chip die or ball grid array devices to the solder deposits of the printed circuit board, resources for having the interposer reconfigure the wiring for testing or replacement purposes, resources for utilizing the flexibility and resilience of the interposer to improve dendrite connections, and resources for heat sinking the flip chip die or ball grid array device by direct thermal contact.