Patents by Inventor Jerome C. Bhat
Jerome C. Bhat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10436647Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.Type: GrantFiled: October 2, 2018Date of Patent: October 8, 2019Assignee: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Jerome C. Bhat, Kuolung Lei, Craig A. Easson, Arvin Emadi, Judy Hermann
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Patent number: 10371578Abstract: A mobile thermal sensor system, a mobile device case, and a process for fabricating a mobile thermal sensor system are described that include using a heat spreader (e.g., a heat sink). In an implementation, the mobile thermal sensor system includes a substrate configured to support an electrical component; a thermal detector package coupled to the substrate, the thermal detector package including a first thermopile, a second thermopile, and a reference temperature detector; and a heat spreader coupled to the substrate. In another implementation, a mobile device case can include a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system.Type: GrantFiled: September 25, 2015Date of Patent: August 6, 2019Assignee: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Arvin Emadi, Jerome C. Bhat
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Publication number: 20190101454Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.Type: ApplicationFiled: October 2, 2018Publication date: April 4, 2019Inventors: Jerome C. Bhat, Kuolung Lei, Craig A. Easson, Arvin Emadi, Judy Hermann
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Patent number: 10113915Abstract: The present disclosure is directed to a sensor package having a thermopile sensor and a reference (or dark channel) thermopile sensor disposed therein for temperature measurements. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, a reference temperature sensor disposed over the substrate surface, a lid assembly disposed over the thermopile sensor and the reference thermopile sensor, and a thermo-optical shield. The thermo-optical shield defines an aperture over the thermopile sensor such that at least a portion of the thermo-optical shield is positioned over the reference thermopile sensor to provide optical and thermal shielding for portions of the sensor package.Type: GrantFiled: December 18, 2015Date of Patent: October 30, 2018Assignee: MAXIM INTEGRATED PRODUCTS, INC.Inventors: Jerome C. Bhat, Kuolung Lei, Craig A. Easson, Arvin Emadi, Judy Hermann
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Thermopile temperature sensor field of view narrowing using integrated light blocking layer and lens
Patent number: 9917242Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.Type: GrantFiled: September 25, 2015Date of Patent: March 13, 2018Assignee: Maxim Integrated Products, Inc.Inventors: Stanley Barnett, Cheng-Wei Pei, Arvin Emadi, Jerome C. Bhat -
Patent number: 9627573Abstract: An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate.Type: GrantFiled: February 19, 2015Date of Patent: April 18, 2017Assignee: Maxim Integreated Products, Inc.Inventors: Jerome C. Bhat, Dan G. Allen, Richard I. Olsen, Kumar Nagarajan
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Patent number: 9564569Abstract: A sensor-in-package device, a process for fabricating a hermetically-sealed sensor-in-package device, and a process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the sensor-in-package device includes a substrate; at least one thermopile, at least one photodetector, at least one light-emitting diode, an ultraviolet light sensor, and a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes a body; a first lid; and a second lid; where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.Type: GrantFiled: December 22, 2015Date of Patent: February 7, 2017Assignee: Maxim Integrated Products, Inc.Inventors: Ken Wang, Jerome C. Bhat, Tian Tian, Seshasayee Ankireddi, Kumar Nagaranjan, Seshasayee Gaddamraja
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Publication number: 20160305829Abstract: A mobile thermal sensor system, a mobile device case, and a process for fabricating a mobile thermal sensor system are described that include using a heat spreader (e.g., a heat sink). In an implementation, the mobile thermal sensor system includes a substrate configured to support an electrical component; a thermal detector package coupled to the substrate, the thermal detector package including a first thermopile, a second thermopile, and a reference temperature detector; and a heat spreader coupled to the substrate. In another implementation, a mobile device case can include a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system.Type: ApplicationFiled: September 25, 2015Publication date: October 20, 2016Inventors: Arvin Emadi, Jerome C. Bhat
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THERMOPILE TEMPERATURE SENSOR FIELD OF VIEW NARROWING USING INTEGRATED LIGHT BLOCKING LAYER AND LENS
Publication number: 20160282194Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.Type: ApplicationFiled: September 25, 2015Publication date: September 29, 2016Inventors: Stanley Barnett, Cheng-Wei Pei, Arvin Emadi, Jerome C. Bhat -
Patent number: 9354111Abstract: A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.Type: GrantFiled: May 14, 2014Date of Patent: May 31, 2016Assignee: Maxim Integrated Products, Inc.Inventors: Nicole D. Kerness, Arkadii V. Samoilov, Jerome C. Bhat, Anand Chamakura, Kumar Nagarajan, Christopher F. Edwards
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Publication number: 20150380627Abstract: A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.Type: ApplicationFiled: December 23, 2014Publication date: December 31, 2015Inventors: Arvin Emadi, Nicole D. Kerness, Arkadii V. Samoilov, Cheng-Wei Pei, Jerome C. Bhat, Kumar Nagarajan, Ken Wang
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Publication number: 20150243824Abstract: An optical sensor is described that includes a light emitter and a photodetector assembly directly attached to a transparent substrate. In one or more implementations, the optical sensor comprises at least one light emitter and a photodetector assembly (e.g., photodiodes, phototransistors, etc.). The light emitter(s) and the photodetector assembly are directly mounted (e.g., attached) to a transparent substrate.Type: ApplicationFiled: February 19, 2015Publication date: August 27, 2015Inventors: Jerome C. Bhat, Dan G. Allen, Richard I. Olsen, Kumar Nagarajan
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Publication number: 20150109785Abstract: A wafer level optical device, system, and method are described that include a substrate, an electronic device disposed on the substrate, an illumination source disposed on the electronic device, an enclosure disposed on the substrate, where the enclosure includes at least one optical surface and covers the electronic device and the illumination source, and at least one solder ball disposed on a side of the substrate distal from the electronic device. In implementations, a process for using the wafer level optical device and lens-integrated package system that employ the techniques of the present disclosure includes receiving a substrate, placing an electronic device on the substrate, placing an illumination source on the electronic device, and placing an enclosure on the substrate, where the enclosure covers the electronic device and the illumination source, and the enclosure and a wall structure form a first compartment and a second compartment.Type: ApplicationFiled: May 14, 2014Publication date: April 23, 2015Applicant: Maxim Integrated Products, Inc.Inventors: Nicole D. Kerness, Arkadii V. Samoilov, Jerome C. Bhat, Anand Chamakura, Kumar Nagarajan, Christopher F. Edwards
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Patent number: 8450760Abstract: One or more circuit elements such as silicon diodes, resistors, capacitors, and inductors are disposed between the semiconductor structure of a semiconductor light emitting device and the connection layers used to connect the device to an external structure. In some embodiments, the n-contacts to the semiconductor structure are distributed across multiple vias, which are isolated from the p-contacts by one or more dielectric layers. The circuit elements are formed in the contacts-dielectric layers-connection layers stack.Type: GrantFiled: April 1, 2011Date of Patent: May 28, 2013Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLCInventors: Jerome C. Bhat, Steven T. Boles
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Patent number: 7994514Abstract: One or more circuit elements such as silicon diodes, resistors, capacitors, and inductors are disposed between the semiconductor structure of a semiconductor light emitting device and the connection layers used to connect the device to an external structure. In some embodiments, the n-contacts to the semiconductor structure are distributed across multiple vias, which are isolated from the p-contacts by one or more dielectric layers. The circuit elements are formed in the contacts-dielectric layers-connection layers stack.Type: GrantFiled: April 21, 2006Date of Patent: August 9, 2011Assignees: Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, LLCInventors: Jérôme C. Bhat, Steven T. Boles
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Publication number: 20110175138Abstract: One or more circuit elements such as silicon diodes, resistors, capacitors, and inductors are disposed between the semiconductor structure of a semiconductor light emitting device and the connection layers used to connect the device to an external structure. In some embodiments, the n-contacts to the semiconductor structure are distributed across multiple vias, which are isolated from the p-contacts by one or more dielectric layers. The circuit elements are formed in the contacts-dielectric layers-connection layers stack.Type: ApplicationFiled: April 1, 2011Publication date: July 21, 2011Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventors: Jérôme C. Bhat, Steven T. Boles
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Publication number: 20100109025Abstract: Rectangular LED dice are mounted on a submount wafer. A first mold has rectangular indentations in it generally corresponding to the positions of the LED dice on the submount wafer. The indentations are filled with silicone, which when cured forms a clear first lens over each LED. Since the wafer is precisely aligned with the mold, the top surfaces of the first lenses are all within a single reference plane irrespective of any x, y, and z misalignments of the LEDs on the wafer. A second mold has rectangular indentations filled with a phosphor-infused silicone so as to form a precisely defined phosphor layer over the clear first lens, whose inner and outer surfaces are completely independent of any misalignments of the LEDs. A third mold forms an outer silicone lens. The resulting PC-LEDs have high chromaticity uniformity from PC-LED to PC LED within a submount wafer and from wafer to wafer, and high color uniformity over a wide viewing angle.Type: ApplicationFiled: November 5, 2008Publication date: May 6, 2010Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLCInventor: Jerome C. Bhat
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Patent number: 7652304Abstract: A light emitting device includes a layer of first conductivity type, a layer of second conductivity type, and a light emitting layer disposed between the layer of first conductivity type and the layer of second conductivity type. A via is formed in the layer of second conductivity type, down to the layer of first conductivity type. The vias may be formed by, for example, etching, ion implantation, diffusion, or selective growth of at least one layer of second conductivity type. A first contact electrically contacts the layer of first conductivity type through the via. A second contact electrically contacts the layer of second conductivity type. A ring that surrounds the light emitting layer and is electrically connected to the first contact electrically contacts the layer of first conductivity type.Type: GrantFiled: August 15, 2006Date of Patent: January 26, 2010Assignee: Philips Lumileds Lighting Company, LLCInventors: Daniel A. Steigerwald, Jerome C. Bhat, Michael J. Ludowise
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Patent number: 7095061Abstract: A light emitting device includes a layer of first conductivity type, a layer of second conductivity type, and a light emitting layer disposed between the layer of first conductivity type and the layer of second conductivity type. A via is formed in the layer of second conductivity type, down to the layer of first conductivity type. The vias may be formed by, for example, etching, ion implantation, diffusion, or selective growth of at least one layer of second conductivity type. A first contact electrically contacts the layer of first conductivity type through the via. A second contact electrically contacts the layer of second conductivity type. A ring that surrounds the light emitting layer and is electrically connected to the first contact electrically contacts the layer of first conductivity type.Type: GrantFiled: October 7, 2004Date of Patent: August 22, 2006Assignee: Philips Lumileds Lighting Company, LLCInventors: Daniel A. Steigerwald, Jerome C. Bhat, Michael J. Ludowise
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Patent number: 7071494Abstract: A light emitting device includes a substrate, a textured layer overlying the substrate, at least one III-nitride layer overlying the textured layer, and a substantially planar light emitting region. Devices incorporating scattering layers may be formed by several different methods. In a first method, an epitaxial layer is deposited then etched to form the textured layer. In a second method, a photomask is deposited and patterned to create openings in the photomask. The textured layer is then preferentially deposited in the openings formed in the photomask. In a third method, the textured layer is deposited under conditions that favor three-dimensional growth, then optionally annealed.Type: GrantFiled: December 11, 2002Date of Patent: July 4, 2006Assignee: Lumileds Lighting U.S. LLCInventors: Daniel A. Steigerwald, Jerome C. Bhat