Abstract: A header connector includes a header body having an internal surface and an external surface. A plurality of first openings and a plurality of second openings extend from the internal surface to the external surface of the header body. A plurality of signal pins are inserted into the plurality of first openings to form an array of pin contacts extending from the internal surface of the header body. A plurality of shield blades are inserted into the plurality of second openings. Each of the plurality of shield blades has at a first end thereof a generally right angle shielding portion configured to be disposed adjacent to a corresponding signal pin. The first ends of the plurality of shield blades are substantially coplanar with the internal surface of the header body.

Abstract: Disclosed herein are backplane interconnect systems that use surface mount technology for mating conductive pins in a header connector to surface mount pads on a printed circuit board. In particular, the interconnect system uses a plurality of conductive pins that are not fully inserted into the body of the header connector, thus allowing them to move during mating with a printed circuit board. In this way, the interconnect system exhibits self-leveling characteristics.