Abstract: Methods for making thin-films on semiconductor substrates, which may be patterned using EUV, include: depositing the organometallic polymer-like material onto the surface of the semiconductor substrate, exposing the surface to EUV to form a pattern, and developing the pattern for later transfer to underlying layers. The depositing operations may be performed by chemical vapor deposition (CVD), atomic layer deposition (ALD), and ALD with a CVD component, such as a discontinuous, ALD-like process in which metal precursors and counter-reactants are separated in either time or space.

Abstract: A system may include a tactile device configured to receive a tactile signal and generate vibrations corresponding to a tactile audio experience based on the tactile signal. The system may also include a computing device configured to perform operations that include receiving an audio signal, and decomposing the audio signal to identify one or more components of the audio signal. The operations may also include generating, by an artificial intelligence system of the computing device, a generated tactile signal based on the one or more components of the audio signal. The operations may also include providing the generated tactile signal to the tactile device.

Abstract: A system may include a tactile device configured to receive a tactile signal and generate vibrations corresponding to a tactile audio experience based on the tactile signal. The system may also include a computing device configured to perform operations that include receiving an audio signal, and decomposing the audio signal to identify one or more components of the audio signal. The operations may also include generating, by an artificial intelligence system of the computing device, a generated tactile signal based on the one or more components of the audio signal. The operations may also include providing the generated tactile signal to the tactile device.

Abstract: A sawdust-free wood cutting apparatus (10) comprises a guide (62, 72) for guiding a piece of wood (W) along a feed path having a cutting zone. At least one circular blade (18b) is mounted in the cutting zone and driven in rotation about an axis transversal to the feed path. The circular blade (18b) has a toothless circumferential cutting edge. A feeder (14, 16) advances the piece of wood (W) to be cut through the cutting zone at a linear speed substantially equal to a tangential speed at the toothless circumferential cutting edge of the circular blade (18b).

Abstract: A sawdust-free wood cutting apparatus (10) comprises a guide (62, 72) for guiding a piece of wood (W) along a feed path having a cutting zone. At least one circular blade (18b) is mounted in the cutting zone and driven in rotation about an axis transversal to the feed path. The circular blade (18b) has a toothless circumferential cutting edge. A feeder (14, 16) advances the piece of wood (W) to be cut through the cutting zone at a linear speed substantially equal to a tangential speed at the toothless circumferential cutting edge of the circular blade (18b).

Abstract: A sawdust-free wood cutting apparatus (10) comprises a guide (62, 72) for guiding a piece of wood (W) along a feed path having a cutting zone. At least one circular blade (18b) is mounted in the cutting zone and driven in rotation about an axis transversal to the feed path. The circular blade (18b) has a toothless circumferential cutting edge. A feeder (14, 16) advances the piece of wood (W) to be cut through the cutting zone at a linear speed substantially equal to a tangential speed at the toothless circumferential cutting edge of the circular blade (18b).

Abstract: A sawdust-free wood cutting apparatus (10) comprises a guide (62, 72) for guiding a piece of wood (W) along a feed path having a cutting zone. At least one circular blade (18b) is mounted in the cutting zone and driven in rotation about an axis transversal to the feed path. The circular blade (18b) has a toothless circumferential cutting edge. A feeder (14, 16) advances the piece of wood (W) to be cut through the cutting zone at a linear speed substantially equal to a tangential speed at the toothless circumferential cutting edge of the circular blade (18b).