Patents by Inventor Jerome Leonard

Jerome Leonard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180106140
    Abstract: A system includes a tubular member (60) including a radially outer surface (60c) and a sensor assembly (128). The sensor assembly includes a strain sensor coupled to the radially outer surface. In addition, the sensor assembly includes a first coating having (134) a first hardness and a first tensile strength. The first coating encases the strain sensor (131,130) and at least part (64) of the outer surface. Further, the sensor assembly includes a second coating (136) having a second hardness that is greater than the first hardness and a second tensile strength that is greater than the first tensile strength. The second coating encases the first coating and at least another part (68) of the radially outer surface.
    Type: Application
    Filed: April 15, 2016
    Publication date: April 19, 2018
    Applicant: BP Corporation North America Inc.
    Inventors: Mark Francis Barrilleaux, David Foti, John D. Henderson, Jerry Henkener, Jerome Leonard, Kyle Robinson, Mark Waldron
  • Patent number: 4012672
    Abstract: A plug-in module for an electronic device includes a header having conductors therein which extend therefrom to form terminals, and a substrate connected to the header and supporting electronic components connected to the conductors. One component has a projecting part which extends through the header and forms a guide to align the module with a socket, to facilitate plug-in of the terminals of the header. The module may be a channel element to control the frequency of a radio device and may include a resonant element, such as a piezo-electric crystal, and a coil for tuning a resonant circuit. The form for the coil may be the projecting part for aligning the module, and also provide access to a core therein for tuning the circuit when the module is plugged into the chassis. The module may include a conducting housing which cooperates with the header to form an enclosed structure. A grounding pin may be provided to establish a ground connection for the circuit on the substrate and for the housing.
    Type: Grant
    Filed: March 28, 1975
    Date of Patent: March 15, 1977
    Assignee: Motorola, Inc.
    Inventors: Larry V. Douglass, Jerome Leonard, Morris L. Minch