Abstract: A drill including a drill spindle capable of driving a cutting tool in movement. The drill has at least one channel for distributing a lubricant to the cutting tool, a pump to supply the channel with lubricant and control element(s) for controlling the flow rate of the pump. Such a drill further has mechanical element(s) for determining at least one piece of information representing the torque exerted on the spindle along its axis during drilling. The control element(s) act on the flow rate of the pump as a function of the torque exerted on the spindle along its axis during drilling.

Abstract: A drill including a drill spindle capable of driving a cutting tool in movement. The drill has at least one channel for distributing a lubricant to the cutting tool, a pump to supply the channel with lubricant and control element(s) for controlling the flow rate of the pump. Such a drill further has mechanical element(s) for determining at least one piece of information representing the torque exerted on the spindle along its axis during drilling. The control element(s) act on the flow rate of the pump as a function of the torque exerted on the spindle along its axis during drilling.

Abstract: The invention relates to a process for manufacturing a power circuit board in which, on the one hand, a printed circuit board including an insulating substrate and a conductive track on one of the sides of the substrate, and on the other hand, a bus bar element, are provided. The bus bar element is welded to the conductive track using a laser. In order to make it possible to produce the weld by laser welding, even with a relatively thick bus bar, the welding is carried out in a zone that is thinner relative to the maximum thickness of the bus bar. Thus, a printed circuit board is obtained with a bus bar having a thick zone for conducting high currents and a thinner zone in order to allow the bus bar to be welded to the conductive track by laser welding.

Abstract: The invention relates to a process for manufacturing a power circuit board in which, on the one hand, a printed circuit board including an insulating substrate and a conductive track on one of the sides of the substrate, and on the other hand, a bus bar element, are provided. The bus bar element is welded to the conductive track using a laser. In order to make it possible to produce the weld by laser welding, even with a relatively thick bus bar, the welding is carried out in a zone that is thinner relative to the maximum thickness of the bus bar. Thus, a printed circuit board is obtained with a bus bar having a thick zone for conducting high currents and a thinner zone in order to allow the bus bar to be welded to the conductive track by laser welding.