Abstract: A component for use in manufacturing electronic interconnection devices, comprised of a polyimide film having a thickness of between about 12 &mgr;m and about 125 &mgr;m. A chromium tiecoat on a surface of the polyimide film, the chromium tiecoat having a thickness of between about 300 Å and about 350 Å and a copper layer on the tiecoat, the copper layer having a thickness between about 300 Å and about 70 &mgr;m.

Abstract: The present invention relates to a bond enhancement process for promoting strong, stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated substrates or superimposed metallic sublayers. According to the process of the invention, a black oxide-coated copper surface is treated with an aqueous reducing solution containing sodium metabisulfite and sodium sulfide to convert the black oxide coating to a roughened metallic copper coating. The roughened metallic copper-coated surface is then passivated and laminated to a resin impregnated substrate. The bond enhancement process is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity.

Abstract: A carrier for use in flexible circuits and tape-automated-bonding includes a layer of vacuum deposited metallic chromium between the copper and polyimide. The chromium is vacuum deposited on the polyimide, affords resistance to undercutting from gold and tin plating baths, and allows conductor to be deposited on both sides of the polyimide.