Abstract: A method for patterning a magnetic memory cell junction is provided herein, which includes etching exposed portions of a stack of layers to a level spaced above a tunneling barrier layer of the stack of layers. In addition, the method may include implanting dopants into exposed portions of the stack of layers. For example, the method may include oxidizing and/or nitriding the exposed portions of the stack of layers. In some embodiments, the steps of etching and implanting dopants may form an upper portion of the magnetic cell junction. Alternatively, the method may include alternating the steps of etching and implanting dopants throughout the thickness of the exposed portions of the stack of layers. In either case, the stack of layers may include a magnetic layer which includes a material adapted to prevent the introduction of dopants underlying the tunneling barrier layer during the step of implanting.

Abstract: A memory array including a conductive line adapted to simultaneously conduct current in at least two distinct directions relative and adjacent to a magnetic junction is provided. In some embodiments, one of the distinct directions may be substantially aligned with an elongated dimension of the magnetic junction, while another of the distinct directions may be substantially aligned with a shortened dimension of the magnetic junction. In yet other embodiments, at least one of the distinct directions may be aligned at an angle between approximately 0 degrees and approximately 90 degrees relative to an elongated dimension of the magnetic junction. In either case, a memory array is provided which includes a contiguous conductive line having a first portion arranged above a magnetic junction of the memory array and a second portion arranged below the magnetic junction. In addition, a method for operating such a magnetic memory array is provided.

Abstract: A method for patterning a magnetic memory cell junction is provided herein, which includes etching exposed portions of a stack of layers to a level spaced above a tunneling barrier layer of the stack of layers. In addition, the method may include implanting dopants into exposed portions of the stack of layers. For example, the method may include oxidizing and/or nitriding the exposed portions of the stack of layers. In some embodiments, the steps of etching and implanting dopants may form an upper portion of the magnetic cell junction. Alternatively, the method may include alternating the steps of etching and implanting dopants throughout the thickness of the exposed portions of the stack of layers. In either case, the stack of layers may include a magnetic layer which includes a material adapted to prevent the introduction of dopants underlying the tunneling barrier layer during the step of implanting.

Abstract: A memory array is provided that includes a conductive line adapted to induce a magnetic field around less than all of the magnetic memory junctions arranged along a row or a column of the array. In some cases, the conductive line may be adapted to induce a magnetic field around more than two magnetic memory cell junctions. Alternatively, the conductive line may be adapted to induce a magnetic field around no more than two magnetic memory cell junctions. In either case, the conductive line may include a first portion vertically aligned with one of a plurality of magnetic memory cell junctions and a second portion vertically aligned with another of the plurality of magnetic memory cell junctions. In some embodiments, the second portion may be positioned such that a direction of current flow through the second portion is different than a direction of current flow through the first portion.