Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

Abstract: A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

Abstract: A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

Abstract: Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

Abstract: A heat sink has a base plate to be clamped against a heat source and one or more heat pipes containing a phase change fluid. Each heat pipe has an elongated tubular evaporator fitted in a channel in the base plate, and a columnar condenser part perpendicular to the base plate forming a structural column for air heat exchange fins. The channel in the base plate is parallel to an edge. An additional channel or ridge is provided, also parallel to the edge, for receiving a clamp or spring clip to urge the base plate against the heat source. The base plate is inexpensively extruded with the parallel channels, ridges, etc., extending across the width of the base plate parallel to the edge. The heat sink has a minimum number of inexpensive parts yet is highly thermally efficient.

Abstract: A heat pipe is provided having a tubular enclosure with an internal surface, a working fluid disposed within the enclosure, and at least one fin projecting radially outwardly from an outer surface of the tubular enclosure. The tubular enclosure is sealed at one end by a base having a grooved sintered wick disposed on at least a portion of its internally facing surface. The grooved, sintered wick comprises a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between said at least two adjacent lands that comprises less than about six average particle diameters.