Abstract: A circuit board unit includes a substrate with imprinted circuit traces and components. A plurality of traces include connecting areas for connection to another trace area or to an external lead. An interconnect element is soldered to each area. Each element is an integral flat strip-like member bent into a substantial L-shape configuration. The element has a flat, square base plate with a control hole centrally located therein. A terminal leg is interconnected to the base plate by a smoothly curved portion and extends at right angles to the base plate and is aligned with the center of the hole. The outer end is a flat terminal having a pin-like projection. A solder paste on the trace has a configuration conforming to the base plate. The base plate is placed on the solder with a slight pressure. Upon melting of the solder, the hole essentially prevents floating of the element while the conformed plate and paste area align the plate on the solder area as a result of surface tension and wetting effect.